1SG280HH2F55E2LG

The 1SG280HH2F55E2LG is an Intel Stratix® 10 GX FPGA in a 2912-BBGA (FCBGA) package, offering a high-capacity programmable fabric for demanding logic and I/O applications. Built on the Stratix 10 family architecture, the device targets high-bandwidth, high-performance designs that require extensive logic, on-chip memory, and large I/O counts.

This device combines the Stratix 10 family innovations—including the Intel Hyperflex core architecture and Intel 14 nm tri-gate technology—with part-specific resources such as 2,800,000 logic elements, 240,123,904 bits of on-chip RAM, and 1,160 I/O to address data center, communications, and advanced processing use cases.

Key Features

• Logic Fabric  2,800,000 logic elements provide large-scale programmable logic capacity for complex designs.
• Logic Cluster Count  350,000 logic cluster units reported for partitioning and design scaling.
• On-Chip Memory  240,123,904 total RAM bits for buffering, caching, and high-throughput data paths.
• I/O Density  1,160 general-purpose I/O pins support extensive board-level interfacing and multi-protocol connectivity.
• Family-Level Core Innovations  Built on the Intel Hyperflex core architecture and 14 nm tri-gate process as described for the Stratix 10 family, enabling higher core performance per the device family documentation.
• Power Supply  Core voltage supply range specified at 820 mV to 880 mV for the device.
• Package & Mounting  2912-BBGA, FCBGA (supplier package 2912-FBGA, FC 55×55); surface-mount package suited for dense board implementations.
• Temperature & Grade  Extended grade device with operating temperature range 0 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-performance networking  Large logic and abundant I/O enable packet processing, switching, and protocol acceleration in network equipment.
• Data center acceleration  On-chip memory and extensive logic capacity support compute acceleration and custom data-path implementations.
• High-speed communications  The Stratix 10 GX family-level transceiver and fabric innovations make this device suitable for demanding link-layer and PHY tasks requiring many I/O channels.
• Signal processing and compute  Large RAM and logic resources support complex DSP pipelines and custom fixed- or variable-precision processing engines.

Unique Advantages

• Massive programmable capacity: 2.8 million logic elements let you implement large, integrated digital systems without external glue logic.
• Extensive on-chip memory: 240,123,904 bits of RAM reduce reliance on external memory for buffering and accelerate local data paths.
• High I/O count: 1,160 I/O pins simplify board-level integration for multi-channel systems and dense interface requirements.
• Advanced family architecture: Leverages Stratix 10 family innovations—such as the Hyperflex core and 14 nm tri-gate process—documented to deliver higher core performance within the series.
• Compact, production-ready packaging: 2912-BBGA FCBGA surface-mount package supports high-density PCB designs and common assembly flows.
• Extended operating grade: Rated 0 °C to 100 °C to meet a broad range of commercial and enterprise deployment environments.

Why Choose 1SG280HH2F55E2LG?

The 1SG280HH2F55E2LG delivers a high-capacity Stratix 10 GX implementation tailored for projects that require large programmable logic, significant on-chip RAM, and a very high I/O count. Its combination of family-level architectural improvements and part-specific resources makes it suitable for systems demanding extensive custom logic integration and high-throughput data handling.

This FPGA is well suited to design teams developing advanced networking, compute acceleration, and high-speed communications equipment who need scalability, integration, and a documented platform-level architecture from the Stratix 10 family.

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