1SG280HH2F55E1VGAS

The 1SG280HH2F55E1VGAS is an Intel Stratix® 10 GX field programmable gate array (FPGA) provided in a 2912-BBGA FCBGA package. It delivers high logic capacity, large on-chip RAM, and extensive I/O in a surface-mount package suitable for demanding bandwidth and processing applications.

Built on the Stratix 10 family innovations, this GX device leverages the Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology to provide increased core performance and reduced power compared to previous-generation high-performance FPGAs.

Key Features

• Core Architecture  Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology—family-level innovations that drive higher core performance and improved power efficiency.
• Logic Capacity  2,800,000 logic elements that support large-scale vector logic, control, and datapath implementations.
• On-Chip Memory  240,123,904 total RAM bits with internal SRAM memory block architecture referenced in product documentation (M20K blocks).
• I/O and Packaging  1,160 I/O pins in a 2912-BBGA (2912-FBGA, FC 55×55) surface-mount package for dense board-level integration and routing.
• Voltage and Thermal  Voltage supply range 770 mV to 970 mV and operating temperature range 0 °C to 100 °C. Device grade: Extended. RoHS compliant.
• High-Speed Transceivers  Family-level transceiver innovations include heterogeneous 3D SiP transceiver tiles and high-speed transceivers (family data cites up to 96 full-duplex channels and data rates up to 28.3 Gbps for supported devices).
• DSP and Memory IP  Variable-precision DSP blocks and hard memory controller/PHY support (family documentation references DDR4 rates and high-performance DSP capabilities).
• System Features  Family features in the documentation include hard PCI Express IP, low-jitter PLLs, device security and configuration management capabilities.

Typical Applications

• Telecommunications & Networking  High-bandwidth transceiver support and large logic/RAM resources make this FPGA suitable for packet processing, backplane interfaces, and optical/electrical bridging functions.
• Data Center Acceleration  High logic density and on-chip memory support compute acceleration, FPGA-based offload, and custom data-path implementations.
• High-Performance Signal Processing  Large DSP resources and abundant RAM bits enable complex filtering, modulation/demodulation, and real-time signal pipelines.
• Secure & Configurable Systems  Device-level security and configuration management features referenced in the Stratix 10 documentation support secure deployments and controlled field updates.

Unique Advantages

• High Logic Density: 2.8 million logic elements provide the capacity to consolidate complex functions and reduce the need for multiple devices.
• Large On-Chip Memory: 240,123,904 total RAM bits support deep buffering, large lookup tables, and state storage without relying solely on external memory.
• Extensive I/O and Compact Package: 1,160 I/Os in a 2912-BBGA (55×55) surface-mount package simplify high-pin-count system designs while minimizing PCB footprint.
• Family-Level Performance Innovations: Intel Hyperflex architecture and 14 nm FinFET technology, as described in the Stratix 10 documentation, provide improved core performance and power efficiency versus prior generations.
• High-Speed Connectivity Options: Family transceiver capabilities enable high-throughput chip-to-chip and backplane interfaces where required by the application.
• Extended-Grade Operating Range: 0 °C to 100 °C operating range and RoHS compliance address a broad set of commercial and extended-temperature system requirements.

Why Choose 1SG280HH2F55E1VGAS?

This Stratix® 10 GX FPGA balances very high logic capacity, substantial on-chip RAM, and a large I/O complement in a compact 2912-BBGA package. It is positioned for engineers who need to implement complex, high-throughput designs while leveraging the Stratix 10 family’s architectural and silicon innovations.

Choose this part when your design requires a scalable, high-performance FPGA platform with strong on-chip memory resources, extensive connectivity, and family-level features documented for high-performance applications. The Extended grade and RoHS compliance help support deployment across a variety of commercial and extended-temperature systems.

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