1SG280HH1F55I2VG

The Intel Stratix® 10 GX 1SG280HH1F55I2VG is a high-density, industrial-grade FPGA in a 2912-BBGA FCBGA package designed for demanding compute and I/O‑intensive applications. Built on the Stratix 10 family architecture, this device combines a large logic element count and extensive on-chip RAM with a wide I/O complement to address high-bandwidth networking, compute acceleration, and advanced signal processing markets.

With 2,800,000 logic elements, 240,123,904 total RAM bits and 1,160 I/O pins, the device delivers the capacity and connectivity required for complex designs while operating across an industrial temperature range and a low-voltage supply domain.

Key Features

• Logic Capacity  2,800,000 logic elements provide substantial programmable fabric for large-scale designs and complex algorithms.
• On‑chip Memory  240,123,904 total RAM bits support large buffering, packet processing, and state storage without immediate external memory dependence.
• I/O and Package  1,160 I/Os in a 2912‑BBGA (55×55 FCBGA) package enable high-density external connectivity for multi‑lane interfaces and parallel data paths.
• Industrial Temperature Range  Rated for −40°C to 100°C to meet the thermal requirements of industrial systems and rugged deployments.
• Core Supply Range  Core voltage supply range of 770 mV to 970 mV for integration into modern low-voltage power domains.
• Mounting and Compliance  Surface-mount device with RoHS compliance for standard PCB assembly and regulatory alignment.
• Stratix 10 Family Innovations  Family-level architecture includes Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology to support high core performance and power efficiency.

Typical Applications

• High‑performance Networking  Multi‑lane switch fabrics, packet processing, and protocol offload where large logic capacity and extensive I/O enable line-rate implementations.
• Data Center Acceleration  Compute and algorithm acceleration that require dense programmable fabric and substantial on‑chip RAM for buffering and stateful processing.
• Telecommunications and Backplane Systems  High-speed transceiver and interface aggregation tasks that benefit from a high pin count and industrial temperature support.
• Advanced Signal Processing  DSP and real‑time processing chains leveraging large logic resources and internal memory for complex filtering, encoding, and compute pipelines.

Unique Advantages

• Extensive Programmable Capacity: 2.8 million logic elements enable integration of large subsystems on a single device, reducing board-level complexity.
• Large On‑Chip RAM: 240,123,904 bits of RAM support deep buffering and state retention for high-throughput data paths.
• High I/O Density: 1,160 I/Os in a 2912‑BBGA footprint provide the connectivity needed for multi‑lane interfaces and dense peripheral integration.
• Industrial Reliability: −40°C to 100°C operating range and industrial grade designation support deployment in demanding environments.
• Modern Process and Architecture: Family-level 14 nm tri‑gate (FinFET) process and Hyperflex core architecture provide the foundation for high core performance and power efficiency.
• Regulatory Compliance: RoHS compliance simplifies environmental conformity for global production.

Why Choose 1SG280HH1F55I2VG?

The 1SG280HH1F55I2VG brings high-density Stratix 10 GX programmable fabric, substantial embedded memory, and a wide I/O count into a single industrial-grade FCBGA package. It is well suited to engineers building high-bandwidth networking gear, data‑center accelerators, telecommunications equipment, and advanced signal processing systems that require large on‑chip resources and robust operating-range performance.

Choosing this device provides long-term design scalability through a family architecture that emphasizes core performance and integration, while its package and I/O complement support complex board-level topologies and multi‑lane interfaces.

If you would like pricing, availability, or a formal quote for 1SG280HH1F55I2VG, submit a request or inquiry to our sales team and include your quantity, delivery timeframe, and any technical requirements. We will respond with a tailored quote and supporting information.