1SG280HH2F55E2VGAS

The 1SG280HH2F55E2VGAS is an Intel Stratix® 10 GX family FPGA offering a high-density programmable fabric based on the Intel Hyperflex™ core architecture. This device targets advanced, high-bandwidth applications that require large logic capacity, abundant on-chip memory, and high I/O density.

With 2,800,000 logic elements, 240,123,904 bits of on-chip RAM and 1,160 I/O pins in a 2912-BBGA (55 × 55 mm FCBGA) package, the device is positioned for compute- and I/O-intensive designs where integration, performance, and power-efficient architecture are key considerations.

Key Features

• Core & architecture  Built on the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) technology, delivering the family-level performance and efficiency innovations described for Stratix® 10 devices.
• Logic capacity  2,800,000 logic elements provide substantial programmable logic resources for complex custom logic and accelerator functions.
• On-chip memory  240,123,904 total RAM bits of embedded memory for buffering, packet processing, and data staging within the FPGA fabric.
• I/O and connectivity  1,160 device I/O pins support high-density external interfacing in demanding system architectures.
• Package & mounting  2912-BBGA, FCBGA (2912-FBGA, FC 55×55) surface-mount package for high pin-count board integration.
• Power  Core supply range specified at 770 mV to 970 mV to match high-performance FPGA power rails and system power management.
• Operating range & grade  Extended grade device with an operating temperature range of 0 °C to 100 °C; RoHS compliant.
• Family-level innovations  Stratix® 10 family features include heterogeneous 3D SiP transceiver tiles, advanced PLLs, and variable precision DSP blocks as described in the device overview.

Typical Applications

• High-performance networking  Use the large logic fabric, substantial on-chip RAM, and high I/O count to implement packet processing, switching, and protocol offloads for networking equipment.
• Data center acceleration  Deploy as a custom accelerator for compute-intensive workloads that benefit from large programmable logic capacity and embedded memory.
• High-speed communications  Leverage the Stratix® 10 family communications primitives and high I/O density for backplane, module, and chip-to-chip interfaces in telecom and datacom systems.
• Custom DSP and signal processing  Implement variable-precision DSP chains and large buffering for signal processing tasks using the device’s logic and RAM resources.

Unique Advantages

• High integration density:  2,800,000 logic elements and 240 Mb of on-chip RAM reduce the need for external components and simplify board-level design.
• Extensive I/O capability:  1,160 I/O pins enable dense system interfaces and flexible routing to external devices and connectors.
• Advanced process and architecture:  Intel 14 nm tri-gate technology combined with Hyperflex™ core architecture delivers family-proven performance and power efficiency innovations.
• System-ready package:  2912-BBGA (55 × 55 mm FCBGA) provides a compact, high-pin-count solution for integration into complex PCBs.
• Controlled core voltage range:  Specified 770 mV to 970 mV core supply helps align the FPGA with system power domains and regulator selections.
• Extended operating grade:  0 °C to 100 °C operating range accommodates many commercial and demanding equipment environments while maintaining RoHS compliance.

Why Choose 1SG280HH2F55E2VGAS?

The 1SG280HH2F55E2VGAS combines a very large logic capacity, substantial on-chip RAM, and a high count of device I/O in a compact 2912-BBGA package. It is suited to system designs that require significant programmable logic, internal memory bandwidth, and dense external interfacing while taking advantage of the Stratix® 10 family’s architectural innovations.

Designers building high-throughput networking, data center acceleration, high-speed communications, or advanced DSP solutions will find this device delivers the integration and configurability to scale complex designs while aligning to system power and thermal constraints.

Request a quote or submit a purchase inquiry to review lead times, pricing, and availability for the 1SG280HH2F55E2VGAS. Our sales team can provide specification sheets and support for your evaluation and integration planning.