1SG280HH2F55I2LG

The 1SG280HH2F55I2LG is a Stratix® 10 GX Field Programmable Gate Array (FPGA) IC in a 2912-BBGA FCBGA package designed for high-performance, industrial-grade applications. It leverages the Stratix 10 family architecture and associated device innovations to deliver high logic density, large embedded memory, and extensive I/O for advanced processing and connectivity tasks.

This device targets demanding systems that need large-scale programmable fabric, significant on-chip RAM, and a high pin-count package—applications where performance, integration, and thermal/voltage robustness are critical design considerations.

Key Features

• High Logic Density  2,800,000 logic elements (LEs) provide substantial programmable fabric for complex logic, compute and control implementations.
• Large Embedded Memory  240,123,904 total RAM bits of on-chip memory support large data buffers, lookup tables and on-chip storage for high-throughput designs.
• Extensive I/O  1,160 I/O pins enable high-bandwidth external interfaces and dense system integration for multi-lane or multi-device topologies.
• Package and Mounting  2912-BBGA, FCBGA (supplier package 2912-FBGA, FC 55×55) in a surface-mount form factor supports compact, high-pin-count board designs.
• Industrial Temperature Range  Rated for operation from −40°C to 100°C, suitable for industrial applications requiring extended ambient tolerance.
• Core Voltage  Core supply range of 820 mV to 880 mV for the device power domain.
• RoHS Compliant  Manufactured to meet RoHS environmental compliance requirements.
• Stratix 10 Family Innovations  As part of the Stratix 10 GX/SX family, the device benefits from architectural advances described for the family such as the Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) technology.

Typical Applications

• High‑Performance Networking  Programmable fabric and ample I/O make this FPGA suitable for packet processing, line cards, and networking infrastructure that require dense logic and memory.
• Data Center Acceleration  Large on-chip RAM and high logic density support acceleration of compute-intensive workloads and custom offload functions.
• High‑Speed Communications  High I/O count and family-level transceiver capabilities in Stratix 10 GX devices enable implementation of multi-lane and backplane interfaces.
• Advanced Signal Processing  Significant logic resources and embedded memory enable complex DSP pipelines and large buffering for real‑time processing tasks.

Unique Advantages

• High Logic Capacity:  2.8M logic elements provide the headroom to implement large, integrated systems on a single FPGA.
• Large On‑Chip Memory:  240M bits of RAM reduce dependence on external memory for buffering and intermediate data storage.
• Broad Connectivity:  1,160 I/Os and a 2912‑ball BGA package simplify routing for complex, multi-interface boards.
• Industrial Reliability:  Rated −40°C to 100°C and RoHS compliant for use in industrial environments with extended temperature requirements.
• Low‑Voltage Core:  820–880 mV core supply supports modern low-voltage power domains and system power budgeting.
• Family‑Level Architectural Benefits:  Access to Stratix 10 GX family innovations such as the Hyperflex core and 14 nm FinFET process as described in the device family documentation.

Why Choose 1SG280HH2F55I2LG?

The 1SG280HH2F55I2LG positions itself for high-density, high-throughput designs that require significant on-chip logic and memory alongside a high-pin-count package. Its industrial temperature rating and RoHS compliance make it a fit for robust system deployments where environmental tolerance and regulatory compliance matter.

This part is suited to system designers and engineers building advanced networking, data center acceleration, communications, or signal-processing platforms who need a scalable FPGA fabric with large embedded RAM and broad I/O integration. Choosing this device delivers a balance of integration, configurability, and family-level architectural benefits.

Request a quote or submit an inquiry to get pricing and availability for the 1SG280HH2F55I2LG. Our team can provide detailed procurement and lead-time information to support your design schedule.