1SG280HH2F55I1VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 1160 2800000 2912-BBGA, FCBGA |
|---|---|
| Quantity | 1,001 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2912-FBGA, FC (55x55) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2912-BBGA, FCBGA | Number of I/O | 1160 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1SG280HH2F55I1VG – Stratix® 10 GX Field Programmable Gate Array (FPGA) IC, 2,800,000 logic elements, 1160 I/Os, 2912-BBGA (55×55)
The 1SG280HH2F55I1VG is an Intel Stratix® 10 GX high-performance FPGA offering 2,800,000 logic elements and 240,123,904 bits of on-chip RAM. Built on the Stratix 10 GX family architecture, it targets advanced networking, compute acceleration and high-bandwidth applications that require large logic capacity, substantial embedded memory and extensive I/O.
This device is industrial grade and designed for surface-mount deployment in a 2912-BBGA (FCBGA) package (2912-FBGA, FC 55×55). Key electrical and environmental specs include a core voltage supply range of 770 mV to 970 mV and an operating temperature range of −40 °C to 100 °C. The part is RoHS compliant.
Key Features
- Logic Capacity 2,800,000 logic elements for large-scale programmable logic implementations and complex system designs.
- On‑chip Memory 240,123,904 total RAM bits to support substantial buffering, lookup tables and state storage directly on device.
- I/O and Packaging 1,160 user I/Os and a 2912-BBGA FCBGA package (2912-FBGA, FC 55×55) optimized for high-density board integration and surface-mount assembly.
- Core Voltage and Power Core supply range of 770 mV to 970 mV, enabling integration into low-voltage power domains.
- Industrial Operating Range Qualified for −40 °C to 100 °C operation for reliable performance in industrial environments.
- Family Innovations (Stratix 10 GX) Devices in the Stratix 10 GX family deploy the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) technology, delivering higher core performance and efficient silicon utilization for compute‑intensive tasks.
- High‑Performance FPGA Features (family-level) Stratix 10 GX family features include high-speed transceivers, hard memory controllers, and advanced DSP capabilities appropriate for high-bandwidth and signal-processing applications.
- Compliance RoHS compliant to support environmentally conscious designs and manufacturing requirements.
Typical Applications
- Data Center Acceleration Large logic capacity and significant on-chip RAM enable hardware acceleration and custom compute offload for analytics and machine learning inference.
- High-Speed Networking Extensive I/O and Stratix 10 GX family transceiver capabilities support packet processing, line cards and backplane interfaces in communications equipment.
- Signal Processing & DSP On-chip memory and family DSP resources make the device suitable for high-throughput signal chain implementations and real-time processing.
- Telecommunications Infrastructure Industrial temperature range and dense logic resources support deployment in switching, routing and transport nodes requiring reliable performance.
Unique Advantages
- High Logic Density: 2.8 million logic elements enable consolidation of complex system functions into a single FPGA, reducing board-level component count.
- Substantial On‑Chip Memory: 240,123,904 bits of RAM provide local storage for buffering, tables and state machines without immediate dependence on external memory.
- Extensive I/O in a Compact Package: 1,160 I/Os in a 2912‑ball FCBGA (55×55) package balance high pin count with a space-efficient footprint for dense system designs.
- Industrial Temperature Range: Rated from −40 °C to 100 °C to meet many industrial deployment requirements where extended temperature operation is needed.
- Low-Voltage Core Operation: 770 mV to 970 mV core supply range enables integration with modern low-voltage power architectures.
- Proven Family Technologies: Leverages Stratix 10 GX family innovations such as the Hyperflex core and 14 nm FinFET process to address high-performance and high-bandwidth system needs.
Why Choose 1SG280HH2F55I1VG?
This Stratix 10 GX FPGA combines very large programmable logic capacity, extensive embedded RAM and a high I/O count in an industrial-grade, surface-mount FCBGA package. It is well suited to system designs that require significant on-chip resources, robust I/O connectivity and operation across a wide temperature range.
Choose the 1SG280HH2F55I1VG when your design demands scalable logic and memory resources alongside industrial operating capability and low-voltage core integration. The device benefits from Stratix 10 GX family-level architectural innovations to help meet high-performance compute and networking requirements while simplifying system integration.
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