1SG280HH1F55E2LG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 1160 2800000 2912-BBGA, FCBGA |
|---|---|
| Quantity | 1,219 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2912-FBGA, FC (55x55) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2912-BBGA, FCBGA | Number of I/O | 1160 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1SG280HH1F55E2LG – Stratix® 10 GX FPGA, 1160 I/O, 2912‑BBGA
The 1SG280HH1F55E2LG is an Intel Stratix® 10 GX field‑programmable gate array in a 2912‑BBGA FCBGA package tailored for high‑performance, high‑bandwidth designs. Built on the Stratix 10 family architecture, it combines a high logic element count, extensive on‑chip memory, and a large I/O complement to address demanding compute, networking, and data‑processing applications.
Key value propositions include a large programmable fabric (2,800,000 logic elements), substantial internal RAM (240,123,904 bits), and support for high‑speed I/O and transceiver features described by the Stratix 10 device family.
Key Features
- Core Architecture Based on the Intel Stratix 10 GX family architecture, which incorporates the Intel Hyperflex core architecture and 14 nm tri‑gate (FinFET) technology as described for the device family.
- Logic Capacity 2,800,000 logic elements for implementing large, complex digital systems and custom accelerators.
- On‑chip Memory 240,123,904 total RAM bits providing substantial embedded memory for buffering, packet processing, and state storage; the family includes M20K internal SRAM memory blocks.
- High I/O Count 1,160 device I/Os to support wide parallel interfaces and extensive peripheral connectivity.
- Transceivers and High‑Speed Interfaces Stratix 10 family transceiver technology and hard IP options (including PCI Express Gen3 and 10G Ethernet hard IP) support high‑bandwidth chip‑to‑chip, module, and backplane links as described in the device overview.
- DSP and Compute Family documentation cites variable precision DSP blocks and high compute density for demanding signal processing workloads.
- Package and Mounting 2912‑BBGA, FCBGA package (supplier device package: 2912‑FBGA, FC (55×55)) in a surface‑mount form factor suitable for production assembly.
- Power and Temperature Core voltage supply range: 820 mV to 880 mV. Operating temperature range: 0°C to 100°C. Device grade: Extended.
- Environmental RoHS compliant.
Typical Applications
- High‑performance networking and switching Large logic capacity, substantial on‑chip memory, and family transceiver features enable packet processing, traffic management, and protocol acceleration.
- Datacenter accelerators High logic density and DSP capabilities support custom compute offloads and data‑plane processing for cloud and enterprise workloads.
- Telecom and backplane systems Extensive I/O and family‑level high‑speed transceiver support make the device suitable for backplane and module interconnect applications.
- Advanced signal processing Significant RAM and DSP resources allow implementation of multichannel DSP algorithms, filtering, and real‑time data manipulation.
Unique Advantages
- High logic density: 2,800,000 logic elements enable complex SoC‑like implementations and large custom hardware accelerators without board‑level ASICs.
- Substantial on‑chip memory: 240,123,904 bits of RAM reduce external memory dependence and improve throughput for buffering and streaming workloads.
- Extensive I/O and package options: 1,160 I/Os in a 2912‑BBGA (55×55) FCBGA package provide broad connectivity while supporting standard surface‑mount assembly.
- Family‑proven high‑speed interfaces: Stratix 10 family transceiver technology and hard IP options (PCIe Gen3, 10G Ethernet, etc.) support demanding bandwidth and low‑latency system designs.
- Designed for performance and efficiency: Family innovations such as the Hyperflex core architecture and FinFET process technology contribute to higher core performance and power‑optimized operation.
- Production‑ready environmental compliance: RoHS compliance helps streamline regulatory and manufacturing requirements.
Why Choose 1SG280HH1F55E2LG?
The 1SG280HH1F55E2LG positions itself as a high‑capacity Stratix 10 GX FPGA option for designs that require large programmable fabrics, extensive embedded memory, and broad I/O. Its combination of 2.8 million logic elements, nearly 240 million bits of RAM, and family‑level high‑speed interface capabilities makes it suitable for advanced networking, compute acceleration, and signal processing systems.
Engineers and procurement teams seeking scalability, robust device capabilities, and a device aligned with the Stratix 10 family innovations will find this part appropriate for complex, bandwidth‑intensive applications where on‑chip resources and high I/O count reduce system complexity and BOM.
Request a quote or submit an inquiry to learn more about pricing, availability, and integration support for the 1SG280HH1F55E2LG.

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