1SG250LU3F50E3XG

The 1SG250LU3F50E3XG is an Intel Stratix® 10 GX field programmable gate array in a 2397‑BBGA FCBGA package. It combines a high logic capacity with large on‑chip RAM and extensive I/O for high‑bandwidth, compute‑intensive FPGA designs.

As a member of the Stratix 10 GX family, the device leverages the series' architectural innovations to address advanced communications, data‑plane processing, and other high‑performance applications that require dense logic, significant embedded memory, and many I/O channels.

Key Features

• Logic Capacity  Contains 2,500,000 logic elements suitable for large-scale, complex FPGA designs.
• Embedded Memory  Provides 204,472,320 total RAM bits to support large on‑chip buffering, lookup tables, and data paths.
• I/O Density  Offers 704 device I/O pins to support wide parallel interfaces and dense system-level connectivity.
• Series Architecture  Series‑level features include the Intel Hyperflex™ core architecture and Intel 14 nm tri‑gate (FinFET) process technology, delivering the family’s targeted performance and efficiency characteristics.
• Transceiver and IP Capability (Series‑level)  Stratix 10 GX/SX family documentation highlights high‑speed transceiver capability and hard IP options such as PCI Express and high‑speed Ethernet, enabling high‑bandwidth system designs.
• Power and Supply  Specified core supply range of 820 mV to 880 mV for the device core power domain.
• Package and Mounting  2397‑BBGA FCBGA package (supplier package: 2397‑FBGA, FC, 50×50) designed for surface mount assembly.
• Operating Range  Extended grade device with an operating temperature range of 0°C to 100°C.
• Regulatory  RoHS compliant.

Typical Applications

• High‑performance networking  Use for packet processing, switching and backplane interfaces that require dense logic and many I/O channels.
• Data center acceleration  Deploy in compute‑intensive accelerator modules that benefit from large on‑chip RAM and substantial logic resources.
• High‑speed communications  Integrate into systems requiring wide parallel interfaces and series‑level transceiver and hard IP capabilities for high bandwidth links.

Unique Advantages

• Massive logic and memory  2,500,000 logic elements combined with 204,472,320 RAM bits supports very large, single‑chip implementations and complex algorithms.
• High I/O count  704 I/O pins enable broad external interfacing without multiple companion devices, simplifying board routing and BOM.
• Series innovations leveraged  Built on the Stratix 10 GX family architecture (including Intel Hyperflex core and 14 nm FinFET process), benefiting designs that require the family’s performance characteristics.
• Compact, surface‑mount package  2397‑BBGA FCBGA (50×50) package provides a high‑density, assembly‑friendly footprint for advanced PCB layouts.
• Extended operating grade  Rated 0°C to 100°C for designs that require an extended commercial temperature range.
• RoHS compliant  Meets RoHS requirements for environmentally restricted substance use.

Why Choose 1SG250LU3F50E3XG?

The 1SG250LU3F50E3XG positions itself for designs that demand high logic capacity, substantial on‑chip RAM, and a large number of I/O pins in a surface‑mount FCBGA package. Its extended grade rating and RoHS compliance make it suitable for production deployments that need reliable operation across a broad commercial temperature range.

Choosing this Stratix 10 GX device brings the advantages of the series‑level Hyperflex architecture and high‑performance FPGA family features together with concrete, verifiable device specifications—helping teams scale complex algorithms and high‑bandwidth interfaces on a single FPGA platform.

Request a quote or submit a sales inquiry to check availability and lead times for the 1SG250LU3F50E3XG. Our team can provide pricing, delivery, and technical support information tailored to your project requirements.