1SG250LN3F43I3XG

The 1SG250LN3F43I3XG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760‑BBGA (1760‑FBGA) package. This industrial‑grade, surface‑mount device provides 2,500,000 logic elements, extensive on‑chip RAM, and high I/O density for demanding systems requiring high throughput and integration.

Built on the Stratix 10 GX family architecture, the device leverages series innovations such as the Intel Hyperflex core architecture and 14 nm tri‑gate (FinFET) process to target high‑performance applications in networking, communications, and advanced signal processing where power, bandwidth and integration are key considerations.

Key Features

• Logic Capacity  Provides 2,500,000 logic elements for complex programmable logic and custom hardware acceleration.
• On‑chip Memory  Total on‑device RAM of 204,472,320 bits to support large buffering, lookup tables, and state storage without external memory for many functions.
• I/O Density  688 user I/O pins enabling wide parallel interfaces and flexible board‑level connectivity for high‑channel designs.
• Package  1760‑BBGA (1760‑FBGA) surface‑mount package; supplier device package listed as 1760‑FBGA (42.5×42.5) providing a compact, high‑pin‑count footprint.
• Power  Core supply voltage range of 820 mV to 880 mV to support efficient operation within the specified supply window.
• Thermal and Environmental  Industrial operating temperature range from −40 °C to 100 °C and RoHS‑compliant construction for regulated environments.
• Family Innovations (series)  Stratix 10 series features noted in the device overview include the Intel Hyperflex core architecture, 14 nm FinFET process, heterogeneous 3D SiP transceiver tiles, and a suite of hard IP blocks for high‑speed interfaces and memory controllers.

Typical Applications

• High‑Speed Networking  Use the device where dense logic, high I/O count, and on‑chip memory are needed for packet processing, switch fabrics, or backbone network functions.
• Telecom & Optical Transport  Suitable for line cards and transport equipment that require programmable transceivers and large FPGA fabric for protocol offload and FEC functions.
• Data Center Acceleration  Deploy for hardware acceleration tasks such as search, compression, and inline data processing that benefit from large logic and substantial on‑chip RAM.
• Advanced Signal Processing  Applicable to high‑performance DSP workloads where dense logic and memory support real‑time processing and buffering.

Unique Advantages

• Substantial Logic Resource: 2.5 million logic elements enable consolidation of complex functions into a single device, reducing board‑level component count.
• Large On‑Chip Memory: Over 204 million bits of RAM support extensive data buffering and lookup storage while minimizing dependence on external memory.
• High I/O Count: 688 I/O pins provide flexibility for wide parallel buses, multi‑lane interfaces, and extensive sensor or port connectivity.
• Industrial Temperature Rating: −40 °C to 100 °C operating range allows deployment in industrial environments requiring extended temperature tolerance.
• Compact High‑Pin Package: 1760‑FBGA (42.5×42.5) footprint concentrates pins and signals in a manageable board area for high‑density designs.
• Series‑Level Architecture Benefits: Leverages Stratix 10 GX family innovations such as the Hyperflex core architecture and FinFET process for architectural advantages delivered across the series.

Why Choose 1SG250LN3F43I3XG?

The 1SG250LN3F43I3XG provides a balance of high logic capacity, large on‑chip memory, and extensive I/O in a single industrial‑grade FPGA package. It is positioned for system designs that require significant programmable resources, deterministic on‑chip storage, and robust thermal performance.

This device suits developers and system integrators building high‑bandwidth communications, data‑center acceleration, and advanced signal processing solutions who need a scalable FPGA platform with series‑level architectural enhancements and a compact, high‑pin‑count package.

Request a quote or submit an inquiry to obtain pricing, lead‑time information, and availability for the 1SG250LN3F43I3XG. Our team can provide details to support board‑level planning and integration.