1SG250HU3F50I3VG

The 1SG250HU3F50I3VG is an Intel Stratix® 10 GX high-performance FPGA in a 2397-BBGA (FCBGA) package. It delivers large logic capacity, extensive on-chip RAM, and a high I/O count for demanding bandwidth and compute-oriented applications.

Built on the Stratix 10 family architecture, the device leverages the family’s Hyperflex core innovations and high-performance FPGA features to serve applications that require heavy logic, large embedded memory, and industrial temperature operation.

Key Features

• Core Logic  2,500,000 logic elements, providing significant programmable fabric capacity for complex designs.
• Logic Array Blocks  312,500 logic blocks for structured arrayed implementation of logic and routing resources.
• On‑chip Memory  204,472,320 total RAM bits, enabling large buffers and memory‑intensive processing directly in the FPGA fabric.
• I/O  704 user I/O pins to support wide parallel interfaces and numerous peripheral connections.
• Power Supply  Supported core voltage range from 770 mV to 970 mV to match low-voltage system rails.
• Package & Mounting  2397-BBGA FCBGA package; supplier package listed as 2397-FBGA, FC (50×50). Surface-mount device for board-level assembly.
• Temperature & Grade  Industrial grade operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance  RoHS compliant.
• Stratix 10 Family Innovations (device family)  Includes Intel Hyperflex core architecture and other Stratix 10 family capabilities described in the device overview, supporting high core performance and family-level system features.

Typical Applications

• High-performance networking and telecom  Large logic capacity and extensive I/O make this device suitable for packet processing, switching, and high-throughput networking functions.
• Data center acceleration  On-chip memory and dense logic resources support compute acceleration and custom data-paths for server and storage applications.
• High-speed serial and interface integration  High I/O count and Stratix 10 family transceiver and interface capabilities (as described in the device overview) enable complex I/O aggregation and protocol handling.
• Signal processing and DSP  Large RAM and fabric capacity accommodate substantial DSP and real-time processing workloads.

Unique Advantages

• Massive logic capacity: 2,500,000 logic elements give designers the headroom to implement large, integrated systems on a single device.
• Extensive embedded memory: 204,472,320 total RAM bits reduce external memory dependence for buffering and large datasets.
• High I/O density: 704 I/O pins support a wide variety of parallel interfaces and complex board-level routing.
• Industrial temperature range: Rated from −40 °C to 100 °C for deployment in industrial environments where extended temperature capability is required.
• Compact, high-density package: 2397-BBGA FCBGA (50×50) packaging balances high pin count with board-space efficiency for dense system designs.
• Standards-conscious design: RoHS compliance aligns with common environmental and manufacturing requirements.

Why Choose 1SG250HU3F50I3VG?

The 1SG250HU3F50I3VG positions itself for system designs that require very large programmable logic, significant on-chip memory, and a high I/O complement, all in an industrial-grade package. Its specification aligns with applications that demand high integration of logic and memory resources while operating across an extended temperature range.

As part of the Intel Stratix 10 GX family, this device benefits from documented family-level architectural advances and system features, making it a fit for engineers targeting scalable, high-capacity FPGA solutions in networking, data center, and signal-processing domains.

Request a quote or submit an inquiry to check availability and pricing for 1SG250HU3F50I3VG and to discuss how it can meet your project requirements.