1SG250HU3F50E3XG

The 1SG250HU3F50E3XG is an Intel Stratix® 10 GX FPGA in a 2397-BBGA FCBGA package with surface-mount mounting. It provides a high-density programmable fabric with 2,500,000 logic elements and 704 general-purpose I/O for advanced, bandwidth- and compute-intensive designs.

Built on the Stratix 10 family architecture, the device targets applications that demand high processing throughput, large on-chip memory, and extensive I/O. The device’s extended grade, low core voltage range, and RoHS compliance support deployment in demanding commercial and enterprise environments.

Key Features

• Logic Capacity Contains 2,500,000 logic elements, enabling large-scale programmable designs and complex custom logic implementations.
• On-chip Memory Provides 204,472,320 total RAM bits and leverages M20K internal SRAM memory blocks for high-capacity, low-latency storage inside the fabric.
• I/O and Package Offers 704 I/O pins in a 2397-BBGA (2397-FBGA, FC 50×50) package with surface-mount mounting for dense board-level integration.
• Core Architecture Part of the Stratix 10 family featuring the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) technology for enhanced core performance and efficiency.
• High-speed Connectivity (Family-level) Stratix 10 family devices include advanced transceiver and interface technologies such as high-rate transceivers, hard PCI Express Gen3 x16, and 10G Ethernet hard IP suitable for high-bandwidth links and backplane applications.
• DSP and Compute (Family-level) Supports variable-precision DSP blocks and high compute performance for signal processing tasks; family documentation cites significant TFLOP-level capabilities for demanding math workloads.
• Power and Voltage Core voltage supply range: 820 mV to 880 mV, reflecting the device’s low-voltage core design consistent with high-density 14 nm process technology.
• Thermal and Grade Extended-grade device with an operating temperature range of 0 °C to 100 °C and RoHS compliance for regulatory alignment.

Typical Applications

• High-performance networking and switching Leverage the device’s high logic density, family-level high-speed transceivers, and Ethernet/PCIe IP to implement packet processing, line cards, and backplane interfaces.
• Data center acceleration Large on-chip RAM and abundant logic elements make the device suitable for hardware acceleration of compute kernels, storage controllers, and protocol offloads.
• High-speed communications Family transceiver capabilities and robust I/O count support multi-channel optical and copper interfaces requiring high aggregate bandwidth.
• Advanced signal processing Variable-precision DSP blocks and large memory resources enable complex DSP tasks such as modulation/demodulation, filtering, and real-time analytics.

Unique Advantages

• Massive programmable capacity: 2.5 million logic elements provide the headroom to implement large, integrated systems on a single FPGA, reducing the need for multiple devices.
• Large on-chip memory: Over 204 million RAM bits support large buffering, deep packet inspection, and memory-intensive algorithms without immediate reliance on external DRAM.
• Extensive I/O integration: 704 I/O pins in a compact 2397-BBGA package simplify board-level routing for dense multi-channel designs.
• Modern process and architecture: Built on 14 nm tri-gate technology with Hyperflex architecture to deliver enhanced core performance and improved power efficiency relative to prior high-performance FPGA generations.
• Design flexibility with hard IP (family-level): Stratix 10 family features such as PCIe and Ethernet hard IP reduce design risk and accelerate time-to-market for common high-speed interfaces.
• Commercial-grade operating envelope: Extended-grade device with a 0 °C to 100 °C operating range and RoHS compliance for deployment in commercial and enterprise systems.

Why Choose 1SG250HU3F50E3XG?

The 1SG250HU3F50E3XG combines very large logic and memory capacity with extensive I/O and a modern FPGA architecture from the Stratix 10 family, making it well suited for complex, high-bandwidth designs that require on-device compute and buffering. Its surface-mount 2397-BBGA package and extended operating range support dense system integration for enterprise and communications equipment.

This device is ideal for engineering teams developing networking, data center acceleration, high-speed communications, and advanced signal-processing solutions that need scalable logic resources, significant on-chip RAM, and integration options provided by the Stratix 10 family.

Request a quote or submit an inquiry for pricing and availability of 1SG250HU3F50E3XG to begin evaluating this Stratix 10 GX FPGA for your next high-performance design.