1SG250HU3F50E1VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2500000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 1,241 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 704 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 312500 | Number of Logic Elements/Cells | 2500000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 204472320 |
Overview of 1SG250HU3F50E1VG – Stratix® 10 GX FPGA, 2,500,000 Logic Elements, 704 I/O, 2397-BBGA
The 1SG250HU3F50E1VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) offered in an extended-grade 2397-BBGA FCBGA package. Designed for high-performance applications, this device combines a large programmable fabric with extensive on-chip memory and high-density I/O to address complex bandwidth and processing requirements.
Built on the Stratix® 10 architecture family, the device is intended for advanced communications, compute acceleration, and system integration tasks that require high logic capacity, substantial RAM resources, and flexible I/O in a surface-mount BGA form factor.
Key Features
- Large Logic Capacity Approximately 2,500,000 logic elements to implement extensive custom logic and complex algorithms.
- On‑Chip Memory Total RAM of 204,472,320 bits for deep buffering, table storage, and state retention across designs.
- High‑Density I/O 704 I/O pins provide broad external interface options for parallel buses, high-speed interfaces, and multi-channel connectivity.
- Advanced Core Architecture Part of the Stratix® 10 GX family, which includes Intel Hyperflex core architecture and 14 nm FinFET technology as described in the device overview.
- Transceiver and IP Capabilities Stratix® 10 family devices include high-performance transceiver and hard IP options (family-level documentation lists features such as high‑speed transceivers and PCIe hard IP).
- Power and Supply Core voltage supply nominal range specified at 770 mV to 970 mV to match modern low-voltage FPGA power domains.
- Package and Mounting Surface-mount 2397-BBGA (FCBGA) package with supplier package reference 2397-FBGA, FC (50×50) for compact, high-density system integration.
- Operating Range and Grade Extended grade with an operating temperature range of 0 °C to 100 °C, suitable for demanding commercial and datacenter environments.
- Environmental Compliance RoHS compliant.
Typical Applications
- High‑Performance Networking: Implement packet processing, switching logic and protocol engines using the large logic fabric and abundant I/O.
- Data Center Acceleration: Offload compute-intensive kernels and custom accelerators using the device’s high logic capacity and substantial on‑chip RAM.
- Telecommunications Equipment: Support multi‑channel PHY interfaces and high‑throughput data paths leveraging the family’s transceiver and hard IP capabilities.
- Compute and DSP Systems: Implement wide datapaths, buffering, and custom signal processing pipelines taking advantage of the FPGA’s memory and logic resources.
Unique Advantages
- Massive Logic Resource: 2.5 million logic elements enable large, consolidated designs that reduce the need for multiple devices.
- Substantial On‑Chip Memory: Over 204 million bits of RAM support large buffers, lookup tables, and stateful processing without external memory for many use cases.
- High I/O Count: 704 I/O pins provide flexibility for multi-lane interfaces and dense peripheral connectivity, simplifying board-level routing and system architecture.
- Extended‑Grade Operation: Rated 0 °C to 100 °C for reliable operation in commercial and datacenter thermal environments.
- Compact, High‑Density Package: 2397-BBGA FCBGA package (50×50 supplier reference) enables high integration density in space-constrained systems.
- Standards‑Oriented Family Features: Access to Stratix® 10 family innovations—such as Hyperflex core architecture and family-level transceiver/PCIe capabilities—helps accelerate design development.
Why Choose 1SG250HU3F50E1VG?
The 1SG250HU3F50E1VG positions itself as a high‑capacity Stratix® 10 GX FPGA suitable for demanding applications that need a large programmable fabric, extensive on‑chip memory, and high-density I/O in a single surface-mount package. Its extended-grade rating and defined core voltage range make it a fit for commercial and datacenter-class systems where performance and integration density are priorities.
Choose this device when your design requires consolidation of complex logic, deep on‑chip buffering, and broad external interfacing while leveraging Stratix® 10 family architecture and ecosystem support documented in the device overview.
Request a quote or submit a pricing inquiry to evaluate 1SG250HU3F50E1VG for your next high‑performance FPGA design.

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