1SG250HU3F50E1VG

IC FPGA 704 I/O 2397BGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2500000 2397-BBGA, FCBGA

Quantity 1,241 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O704Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs312500Number of Logic Elements/Cells2500000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits204472320

Overview of 1SG250HU3F50E1VG – Stratix® 10 GX FPGA, 2,500,000 Logic Elements, 704 I/O, 2397-BBGA

The 1SG250HU3F50E1VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) offered in an extended-grade 2397-BBGA FCBGA package. Designed for high-performance applications, this device combines a large programmable fabric with extensive on-chip memory and high-density I/O to address complex bandwidth and processing requirements.

Built on the Stratix® 10 architecture family, the device is intended for advanced communications, compute acceleration, and system integration tasks that require high logic capacity, substantial RAM resources, and flexible I/O in a surface-mount BGA form factor.

Key Features

  • Large Logic Capacity  Approximately 2,500,000 logic elements to implement extensive custom logic and complex algorithms.
  • On‑Chip Memory  Total RAM of 204,472,320 bits for deep buffering, table storage, and state retention across designs.
  • High‑Density I/O  704 I/O pins provide broad external interface options for parallel buses, high-speed interfaces, and multi-channel connectivity.
  • Advanced Core Architecture  Part of the Stratix® 10 GX family, which includes Intel Hyperflex core architecture and 14 nm FinFET technology as described in the device overview.
  • Transceiver and IP Capabilities  Stratix® 10 family devices include high-performance transceiver and hard IP options (family-level documentation lists features such as high‑speed transceivers and PCIe hard IP).
  • Power and Supply  Core voltage supply nominal range specified at 770 mV to 970 mV to match modern low-voltage FPGA power domains.
  • Package and Mounting  Surface-mount 2397-BBGA (FCBGA) package with supplier package reference 2397-FBGA, FC (50×50) for compact, high-density system integration.
  • Operating Range and Grade  Extended grade with an operating temperature range of 0 °C to 100 °C, suitable for demanding commercial and datacenter environments.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • High‑Performance Networking: Implement packet processing, switching logic and protocol engines using the large logic fabric and abundant I/O.
  • Data Center Acceleration: Offload compute-intensive kernels and custom accelerators using the device’s high logic capacity and substantial on‑chip RAM.
  • Telecommunications Equipment: Support multi‑channel PHY interfaces and high‑throughput data paths leveraging the family’s transceiver and hard IP capabilities.
  • Compute and DSP Systems: Implement wide datapaths, buffering, and custom signal processing pipelines taking advantage of the FPGA’s memory and logic resources.

Unique Advantages

  • Massive Logic Resource: 2.5 million logic elements enable large, consolidated designs that reduce the need for multiple devices.
  • Substantial On‑Chip Memory: Over 204 million bits of RAM support large buffers, lookup tables, and stateful processing without external memory for many use cases.
  • High I/O Count: 704 I/O pins provide flexibility for multi-lane interfaces and dense peripheral connectivity, simplifying board-level routing and system architecture.
  • Extended‑Grade Operation: Rated 0 °C to 100 °C for reliable operation in commercial and datacenter thermal environments.
  • Compact, High‑Density Package: 2397-BBGA FCBGA package (50×50 supplier reference) enables high integration density in space-constrained systems.
  • Standards‑Oriented Family Features: Access to Stratix® 10 family innovations—such as Hyperflex core architecture and family-level transceiver/PCIe capabilities—helps accelerate design development.

Why Choose 1SG250HU3F50E1VG?

The 1SG250HU3F50E1VG positions itself as a high‑capacity Stratix® 10 GX FPGA suitable for demanding applications that need a large programmable fabric, extensive on‑chip memory, and high-density I/O in a single surface-mount package. Its extended-grade rating and defined core voltage range make it a fit for commercial and datacenter-class systems where performance and integration density are priorities.

Choose this device when your design requires consolidation of complex logic, deep on‑chip buffering, and broad external interfacing while leveraging Stratix® 10 family architecture and ecosystem support documented in the device overview.

Request a quote or submit a pricing inquiry to evaluate 1SG250HU3F50E1VG for your next high‑performance FPGA design.

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