1SG250HU2F50I1VG

The 1SG250HU2F50I1VG is a Stratix® 10 GX Field Programmable Gate Array (FPGA) in a 2397-BBGA FCBGA package designed for high-performance, large-capacity logic integration. It provides 2,500,000 logic elements and 204,472,320 bits of on-chip RAM to support complex, latency-sensitive designs.

As a member of the Stratix 10 family, this device leverages the family’s Hyperflex core architecture and 14 nm tri-gate (FinFET) technology to address demanding applications that require increased processing performance and efficient power use.

Key Features

• Core Architecture  Built on Stratix 10 GX family technology incorporating the Intel Hyperflex core architecture and 14 nm tri-gate process, described in the family overview as delivering improved core performance and power efficiency.
• Logic Capacity  2,500,000 logic elements suitable for large-scale FPGA designs and complex custom logic implementations.
• Embedded Memory  204,472,320 total RAM bits for on-chip buffering, frame storage, and multi-tenant data processing.
• I/O Count  704 general-purpose I/O pins to support broad peripheral and interface integration needs.
• Package & Mounting  2397-BBGA (FCBGA) package; supplied as a surface-mount device with a 50 × 50 mm footprint per supplier package information.
• Voltage & Power  Core voltage supply range is 770 mV to 970 mV, enabling designers to target required power-performance operating points.
• Operating Range & Grade  Industrial grade device rated for operation from −40 °C to 100 °C; RoHS compliant.
• Family-Level System Features  Stratix 10 family-level capabilities described in the device overview include advanced transceiver and hard-IP options (PCI Express, Ethernet, memory controllers) and SoC variants with embedded processor systems—refer to the family documentation for available hard IP and SoC options.

Typical Applications

• High‑performance networking and switching  Large logic capacity and extensive on-chip RAM support packet processing, forwarding, and complex traffic management functions.
• Data center and compute acceleration  High logic density and family-level features for high-throughput data paths make the device suitable for hardware acceleration tasks and custom compute pipelines.
• Telecommunications and transport  Surface-mount FCBGA packaging, wide operating temperature, and family transceiver capabilities suit line cards, backplane interfacing, and protocol processing.
• Advanced signal processing  Large embedded RAM and extensive logic resources enable deterministic, real-time DSP chains and protocol offload implementations.

Unique Advantages

• Very high logic density: 2,500,000 logic elements give headroom for large, system-level functions on a single device, reducing the need for multi-FPGA partitions.
• Substantial on-chip memory: Over 204 million bits of RAM allow significant buffering and local storage to minimize external memory dependency.
• Comprehensive I/O count: 704 I/O pins enable broad peripheral connectivity and flexible board-level integration.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in industrial environments requiring a wide thermal range.
• Family-level advanced architecture: Hyperflex core and 14 nm FinFET family technologies bring documented performance and power advantages for high-throughput designs.
• RoHS compliant: Meets RoHS requirements for environmental compliance.

Why Choose 1SG250HU2F50I1VG?

The 1SG250HU2F50I1VG delivers substantial on-chip resources—2.5M logic elements and 204,472,320 RAM bits—within a high-density FCBGA package, making it well suited for system architects who need to consolidate complex functions onto a single FPGA. Its industrial temperature rating and broad I/O count make it appropriate for demanding networking, compute acceleration, and telecom applications.

By combining Stratix 10 family architectural innovations with explicit device-level capacity and packaging, this part provides a scalable platform for designers pursuing high-performance, integrated solutions where on-chip logic and memory density, I/O flexibility, and robust operating range are critical.

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