1SG250HU2F50E2LG

The 1SG250HU2F50E2LG is an Intel Stratix® 10 GX field programmable gate array featuring 2,500,000 logic elements and a high-density on-chip memory of 204,472,320 bits. Built on the Stratix 10 family architecture, it targets advanced systems that require large programmable logic capacity, extensive I/O, and high integration in a surface-mount FCBGA package.

This device combines the Stratix 10 family innovations—including the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate technology—with part-specific capabilities such as 704 I/Os, a 2397-BBGA FCBGA package, extended grade operation, and RoHS compliance.

Key Features

• Core and Architecture  Intel Stratix 10 family architecture with Intel Hyperflex™ core technology referenced in the device overview; designed for high-performance FPGA implementation.
• Logic Density  2,500,000 logic elements (logic cells) to support large-scale programmable designs and complex logic integration.
• On-Chip Memory and DSP  204,472,320 total RAM bits of embedded memory to accelerate data buffering, lookup tables, and in‑fabric data storage.
• I/O and Package  704 I/Os for broad external interfacing; supplied in a 2397-BBGA FCBGA package (supplier package: 2397-FBGA, FC 50×50) for high pin-count board designs.
• Power Supply  Specified core voltage supply range of 820 mV to 880 mV for the device core.
• Thermal and Grade  Extended grade with an operating temperature range of 0 °C to 100 °C, suitable for many commercial and industrial-adjacent environments.
• Mounting and Compliance  Surface-mount FCBGA package and RoHS compliant.
• Family-Level Capabilities (from device overview)  Stratix 10 family features include advanced transceiver technology, hard IP blocks such as PCI Express and Ethernet options, fractional-synthesis PLLs, and heterogeneous 3D SiP transceiver tiles as described in the device overview.

Typical Applications

• High-performance networking and telecom  Large logic capacity and family transceiver/IP capabilities make this device suitable for line cards, switches, and routers that require high bandwidth and complex packet processing.
• Data center acceleration  High logic density and large on-chip memory support hardware acceleration tasks, data-path processing, and inline analytics in server and appliance designs.
• Backplane and board-to-board systems  High I/O count and family transceiver features support high-speed interconnects and complex multi-board systems.
• Signal processing and compute-intensive tasks  Large embedded memory and the Stratix 10 family’s DSP and fabric architecture are suited for demanding signal processing and algorithm acceleration.

Unique Advantages

• High logic capacity:  2,500,000 logic elements provide the headroom for complex, large-scale FPGA designs without external logic partitioning.
• Substantial on‑chip memory:  204,472,320 total RAM bits reduce dependence on external memory for many buffering and data-path requirements.
• Extensive external interfacing:  704 I/Os enable rich peripheral connectivity and flexible board-level integration.
• Compact high-pin package:  2397‑BBGA FCBGA (50×50 supplier package) delivers the pin count needed for dense I/O and signal routing in a single package.
• Family innovation foundation:  Built on the Stratix 10 family platform and Intel Hyperflex architecture as described in the device overview, enabling deployment of advanced transceiver and hard-IP options where required.
• Regulatory and assembly readiness:  Surface-mount FCBGA packaging and RoHS compliance support modern PCB assembly and environmental requirements.

Why Choose 1SG250HU2F50E2LG?

The 1SG250HU2F50E2LG positions itself as a high-density Stratix 10 GX FPGA option for engineers who need significant logic resources, large on-chip memory, and extensive I/O in a single FCBGA package. Its extended-grade temperature range, RoHS compliance, and family-level architecture features make it a fit for advanced networking, compute acceleration, and high-speed interfacing applications where integration and capacity matter.

For designs that demand large programmable fabric and on-chip storage backed by the Stratix 10 device family innovations, this part provides a straightforward building block to scale performance and integration without fragmenting functionality across multiple devices.

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