1SG250HU2F50E2VG

The 1SG250HU2F50E2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 2397-BBGA FCBGA package. It combines a high-density programmable fabric with series-level Intel innovations, delivering performance and efficiency for advanced, high-bandwidth applications.

Based on the Intel Hyperflex™ core architecture and 14 nm tri-gate (FinFET) technology described for the Stratix 10 GX family, this device targets designs that require large logic capacity, extensive on-chip memory, and broad I/O connectivity.

Key Features

• Core Architecture  Built on the Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) process as described for the Stratix 10 GX family, enabling the series' performance and efficiency improvements.
• Logic Capacity  2,500,000 logic elements (LEs) to implement large, complex designs.
• On‑Chip Memory  204,472,320 total RAM bits for embedded buffering, state storage, and large-data processing.
• I/O Density & Package  704 I/O pins in a 2397-BBGA FCBGA package (supplier package: 2397-FBGA, FC 50×50); surface-mount mounting type for board-level integration.
• Power Supply  Core voltage supply range from 770 mV to 970 mV to match system power-rail requirements.
• Operating Range & Grade  Extended-grade device with an operating temperature range of 0 °C to 100 °C; RoHS compliant.
• Family-Level I/O & Transceiver Capabilities  Stratix 10 GX family features include high-speed transceivers, hard PCIe and Ethernet IP blocks, and heterogeneous SiP transceiver tiles as described in the device overview.

Typical Applications

• High-Speed Networking  Use in switches, routers and network appliances where large logic capacity and abundant I/O support complex packet processing and line-rate interfaces.
• Data Center Acceleration  FPGA-based accelerators and PCIe-attached cards that require dense compute fabric and large on-chip memory for low-latency workloads.
• Telecom and Backplane Systems  Support for high-bandwidth serial interfaces and hard networking IP makes the device suitable for transport, aggregation and backplane functions.
• Test & Measurement and DSP  Large logic and memory resources enable implementation of high-performance signal processing chains and real-time analysis systems.

Unique Advantages

• High Logic Density: 2,500,000 logic elements provide the capacity to implement large, integrated designs without partitioning across multiple devices.
• Large On‑Chip Memory: Over 204 million RAM bits reduce dependence on external memory for buffering and frequent data reuse.
• Extensive I/O: 704 I/O pins and FCBGA packaging support complex board-level routing and multiple high-speed interfaces.
• Low-Voltage Core: 770 mV to 970 mV core supply range aligns with modern power architectures for efficient operation.
• Extended Temperature Grade: Rated for 0 °C to 100 °C operation to meet a range of commercial and industrial deployments requiring extended temperature tolerance.
• Family-Level Integration: Stratix 10 GX family features such as Hyperflex architecture, advanced transceiver options, and hard networking IP enable platform-level design reuse and accelerated development.

Why Choose 1SG250HU2F50E2VG?

The 1SG250HU2F50E2VG delivers substantial programmable capacity, large on-chip memory, and high I/O density in a compact FCBGA package, making it suitable for demanding, high-bandwidth designs. Its series-level Hyperflex architecture and 14 nm FinFET heritage provide the performance and power-efficiency characteristics needed for advanced networking, acceleration, and signal-processing applications.

For design teams targeting scalable performance, extensive integration, and robust deployment conditions, this Stratix 10 GX device offers a balance of logic, memory, I/O and power characteristics supported by Intel's device family features and documentation.

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