1SG250HU2F50E1VG

The 1SG250HU2F50E1VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) supplied in a 2397‑BBGA FCBGA package. Built on the Stratix 10 GX family architecture, the device targets advanced, high‑performance applications that require large logic capacity, extensive on‑chip memory, and broad I/O connectivity.

With a combination of the Intel Hyperflex core architecture (family feature), 2,500,000 logic elements, 204,472,320 total RAM bits and up to 704 I/O pins, this FPGA addresses demanding workloads in networking, communications, data center acceleration and other bandwidth‑intensive systems while operating across an extended temperature range.

Key Features

• Core & Architecture  Intel Stratix 10 GX family features include the Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) process as described in the device family overview.
• Logic Density  2,500,000 logic elements provide large programmable fabric capacity for complex custom logic and high‑parallelism designs.
• On‑chip Memory  204,472,320 total RAM bits of embedded memory to support buffer, packet processing and high‑throughput data paths.
• I/O Capability  704 I/O pins enable broad external connectivity for high‑speed interfaces and multi‑lane systems.
• Package & Mounting  2397‑BBGA (FCBGA) package; supplier device package listed as 2397‑FBGA, FC (50×50). Surface mount mounting type.
• Power Supply  Core voltage supply range specified at 770 mV to 970 mV for device power planning.
• Operating Range  Extended grade with an operating temperature range of 0 °C to 100 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High‑Performance Networking  Use for packet processing, line cards and switch fabrics where large logic capacity and extensive I/O support complex, low‑latency data paths.
• Data Center Acceleration  Deploy in accelerator cards and appliances that require dense logic, large on‑chip RAM and flexible interfaces for custom compute offload.
• Telecommunications Infrastructure  Implement in PHY processing, backplane interface and protocol offload functions that need high throughput and many I/O channels.

Unique Advantages

• High Logic Capacity: 2.5 million logic elements enable implementation of large, complex designs without partitioning across multiple devices.
• Substantial On‑Chip Memory: Over 204 million bits of embedded RAM reduce reliance on external memory for buffering and state storage.
• Extensive I/O: 704 I/O pins give design flexibility for multi‑lane, multi‑protocol interfaces and dense interconnects.
• Family‑Level Performance and Efficiency: Stratix 10 GX family innovations such as the Hyperflex core architecture and 14 nm FinFET technology are documented to deliver increased core performance and improved power efficiency (family overview).
• Surface Mount, High‑Density Package: 2397‑BBGA FCBGA packaging supports compact board designs while providing the connectivity required for complex systems.
• Extended Operating Range: Device grade and 0 °C to 100 °C operating temperature accommodate a wide range of commercial and enterprise deployments.

Why Choose 1SG250HU2F50E1VG?

The 1SG250HU2F50E1VG positions itself for designs that demand high logic density, deep on‑chip memory and broad I/O capability within the Stratix 10 GX family architecture. Its specification set supports complex data‑path implementations and high‑throughput workloads while allowing designers to leverage family‑level innovations for performance and efficiency.

This device is suited to system integrators and engineering teams building networking equipment, data center accelerators and communications infrastructure who need a scalable, high‑capacity FPGA platform backed by documented family features and compliance details.

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