1SG250HU1F50I1VG

The Intel Stratix® 10 GX 1SG250HU1F50I1VG is a high-capacity field programmable gate array (FPGA) implementing the Intel Hyperflex™ core architecture on 14 nm tri‑gate process technology. It delivers a combination of large programmable logic, substantial on‑chip RAM, high I/O density and family-level high‑performance transceiver and hard IP features targeted at demanding communications, networking, and compute‑intensive embedded systems.

This device is provided in a 2397‑BBGA (FCBGA) surface‑mount package with 704 I/O and is specified for industrial operation (‑40 °C to 100 °C). Its power supply range and on‑chip resources support complex, high‑bandwidth designs that require extensive logic, memory and I/O integration.

Key Features

• Core & architecture 
  Intel Hyperflex™ core architecture implemented in Intel 14 nm tri‑gate (FinFET) technology for the Stratix 10 GX device family (family-level innovation referenced in the device overview).
• Programmable logic 
  Provides 2,500,000 logic elements for large-scale FPGA implementations and complex logic integration.
• On‑chip memory 
  Total on‑chip RAM of 204,472,320 bits; family devices include M20K internal SRAM memory blocks for efficient embedded storage.
• I/O and transceivers 
  704 I/O pins in the 2397‑BBGA package. Family transceiver features include high‑speed channels and transceiver data rates up to 28.3 Gbps (family-level capability described in the device overview).
• Hard IP and DSP 
  Family-level hard IP options include PCI Express Gen3 x16 and 10G Ethernet hard IP, along with variable precision DSP blocks for high‑throughput signal processing (referenced in the Stratix 10 GX/SX overview).
• Power and supply 
  Device supply range specified at 770 mV to 970 mV to support core operation within defined voltage limits.
• Package and mounting 
  2397‑BBGA (FCBGA) surface‑mount package; supplier package listed as 2397‑FBGA, FC (50×50).
• Operating conditions & compliance 
  Industrial grade operation from ‑40 °C to 100 °C and RoHS compliant.

Typical Applications

• High‑speed networking and switches 
  Use the device’s high I/O count and family transceiver capabilities for line card and switch fabric implementations requiring large logic capacity and high bandwidth.
• Telecommunications infrastructure 
  Leverage hard IP blocks such as PCIe and 10G Ethernet along with abundant on‑chip memory for protocol processing and packet handling.
• Data center acceleration 
  Apply the large logic element count and DSP resources for custom acceleration tasks and data‑plane processing.
• Embedded compute and SoC integration 
  Integrate complex control and processing subsystems where substantial programmable logic and memory are required within a single FCBGA package.

Unique Advantages

• Massive programmable capacity: 2,500,000 logic elements enable deep, complex designs without immediate partitioning across multiple devices.
• Large on‑chip RAM: 204,472,320 bits of total RAM support large buffers, lookup tables and state storage for high‑performance data flows.
• High I/O density: 704 I/O pins in a 2397‑BBGA package provide flexibility for wide parallel interfaces and dense connector configurations.
• Industrial thermal range: Specified operation from ‑40 °C to 100 °C for deployment in industrial environments.
• Low‑voltage core operation: Core supply range of 770 mV to 970 mV to align with modern power‑optimized designs.
• Standards‑oriented family features: Family-level support for high‑speed transceivers, PCIe Gen3 x16 and Ethernet hard IP simplifies integration of common high‑bandwidth system functions.
• Regulatory compliance: RoHS compliant for environmental and manufacturing compliance requirements.

Why Choose 1SG250HU1F50I1VG?

The 1SG250HU1F50I1VG delivers a combination of large logic capacity, substantial on‑chip memory and high I/O density in a single industrial‑grade FCBGA package. It is suited to designers who need to consolidate complex, high‑bandwidth processing, protocol handling and DSP tasks into a single FPGA device.

Positioned for advanced communications, networking and compute‑intensive embedded systems, the device inherits family-level innovations and hard IP options described in the Intel Stratix 10 GX overview, providing a scalable platform for long‑lifecycle designs that demand performance, integration and ecosystem support.

Request a quote or submit an inquiry for 1SG250HU1F50I1VG to evaluate suitability for your next high‑performance FPGA design.