1SG250HU1F50E2LG

The 1SG250HU1F50E2LG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 2397-BBGA FCBGA package. It provides a high logic-density fabric with 2,500,000 logic elements, large on-chip RAM, and a substantial I/O complement for demanding system integration.

Built on the Stratix 10 GX family innovations—including the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology—this device targets high-bandwidth, performance-focused designs that require dense logic, abundant memory, and flexible I/O connectivity while operating over an extended temperature range.

Key Features

• Logic Density  2,500,000 logic elements for complex logic implementations and large-scale FPGA designs.
• On‑Chip Memory  Total RAM capacity of 204,472,320 bits to support deep buffering, large lookup tables, and memory‑intensive processing.
• I/O Count  704 I/O pins to enable extensive external interfacing and high-port-count system connectivity.
• Core Architecture  Built on the Intel Stratix 10 GX family architecture, which includes the Intel Hyperflex core and 14 nm tri-gate (FinFET) process as described in the family overview.
• Power Supply  Core voltage supply range of 820 mV to 880 mV, supporting the device’s low-voltage core operation.
• Package & Mounting  2397-BBGA (FCBGA) supplier device package (2397-FBGA, FC, 50×50) designed for surface-mount PCB assembly.
• Temperature Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for applications requiring wider thermal tolerance than commercial grade.
• Regulatory  RoHS compliant.

Typical Applications

• High‑Performance Networking  Use the device for packet processing, switching fabrics, and high-density I/O aggregation where large logic resources and extensive memory are required.
• Data Center Acceleration  Implement custom accelerators and memory‑intensive algorithms that benefit from the device’s high logic element count and substantial on-chip RAM.
• High‑Speed Communications  Deploy in systems that require many external interfaces and configurable I/O for protocol handling and bridging functions.
• Advanced Signal Processing  Support DSP and streaming applications that need significant logic and on-chip memory to buffer and compute in real time.

Unique Advantages

• Very high logic capacity: 2,500,000 logic elements enable large, complex designs without partitioning across multiple devices.
• Large on‑chip RAM: 204,472,320 total RAM bits reduce dependence on external memory and improve data throughput for buffering and state storage.
• Extensive I/O availability: 704 I/O pins simplify board-level integration and support high fan-out connectivity to peripherals and transceivers.
• Advanced family architecture: Built on the Stratix 10 GX family platform and Intel Hyperflex core architecture, leveraging proven family innovations.
• Compact FCBGA packaging: 2397‑BBGA (50×50) package provides a dense, manufacturable footprint for space-constrained boards.
• Extended operating range: 0 °C to 100 °C grade suits applications that need broader thermal tolerance than standard commercial parts.

Why Choose 1SG250HU1F50E2LG?

The 1SG250HU1F50E2LG positions itself for systems that demand very high logic density, substantial on-chip memory, and a large I/O count within a compact FCBGA package. Its heritage in the Intel Stratix 10 GX family means the device benefits from the family’s architecture and process innovations.

This FPGA is well suited to designers building high-bandwidth, compute-intensive applications who need scalable logic resources, significant embedded RAM, and flexible external connectivity — all delivered in an extended-temperature, RoHS‑compliant package.

Request a quote or submit an inquiry to obtain pricing, lead times, and availability for the 1SG250HU1F50E2LG.