1SG250HN3F43I2VG

The 1SG250HN3F43I2VG is an Intel Stratix® 10 GX FPGA device built on the Stratix 10 family architecture. It delivers very high logic capacity and on-chip memory for bandwidth- and compute-intensive designs, packaged in a 1760-BBGA FCBGA footprint.

Designed for advanced communications, compute acceleration and high-performance system designs, this industrial-grade device combines Intel Stratix 10 family innovations with a large I/O count and broad on-chip RAM to address demanding embedded and networking use cases.

Key Features

• Core architecture: Based on Intel Stratix 10 GX family innovations, including the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) process, as described in the Stratix 10 GX/SX device overview.
• Logic capacity: 2,500,000 logic elements, enabling large, complex designs and high resource density on a single device.
• On-chip memory: 204,472,320 total RAM bits to support large buffering, data staging and in-fabric memory requirements.
• I/O and packaging: 688 general-purpose I/O pins in a surface-mount 1760-BBGA (FCBGA) package; supplier device package size 42.5 × 42.5 mm.
• Power rails: Core voltage supply range 770 mV to 970 mV to match system power architectures and sequencing requirements.
• Temperature and grade: Industrial-grade device rated for operation from −40 °C to 100 °C.
• Family-level capabilities: Stratix 10 family features include high-performance transceiver and hard IP options, fractional-synthesis PLLs, hard PCIe and high-speed SERDES architectures (refer to Stratix 10 family documentation for details).
• RoHS compliant: Meets RoHS requirements for lead-free assembly and environmental compliance.

Typical Applications

• High-speed networking and switching: Large logic capacity and extensive I/O support complex packet processing, custom switching fabrics and high-throughput datapaths.
• Data center acceleration: On-chip RAM and high logic density enable hardware acceleration of compute and storage functions in rack-mounted and appliance platforms.
• Telecommunications infrastructure: Stratix 10 family capabilities and device memory make this FPGA suitable for line cards, aggregation nodes and backplane processing.
• Signal processing and DSP: Large embedded memory and dense logic allow implementation of wideband DSP pipelines and custom algorithm accelerators.

Unique Advantages

• Very high logic density: 2.5 million logic elements provide the headroom to consolidate multiple functions on a single device, reducing system BOM and board count.
• Substantial on-chip memory: Over 204 million bits of RAM facilitate large buffers, deep FIFOs and in-device data staging to support high-throughput designs.
• Extensive I/O in a compact package: 688 I/O pins in a 1760-BBGA FCBGA package deliver broad connectivity while conserving PCB area.
• Industrial temperature range: −40 °C to 100 °C rating supports deployment in industrial and infrastructure environments.
• Controlled core voltage range: 770 mV–970 mV compatibility with modern power architectures and sequencing strategies.
• Stratix 10 family innovations: Access to family-level features such as Hyperflex core architecture and high-performance transceiver and IP building blocks for demanding system designs.

Why Choose 1SG250HN3F43I2VG?

The 1SG250HN3F43I2VG is positioned for engineers who need a high-capacity FPGA with substantial on-chip memory and extensive I/O in an industrial temperature-rated package. Its placement in the Stratix 10 GX family brings architectural benefits and family-level IP that support high-throughput, compute-heavy designs.

This device is ideal for complex communications, data center acceleration and high-performance signal processing applications where consolidation of functionality, large memory resources and reliable operation across a wide temperature range are required.

Request a quote or submit an inquiry for pricing and availability for the 1SG250HN3F43I2VG to evaluate it for your next high-performance FPGA design.