1SG250HN3F43I1VG

The 1SG250HN3F43I1VG is an Intel Stratix® 10 GX field programmable gate array supplied in a 1760‑BBGA (1760‑FBGA, 42.5 × 42.5 mm) package. Built on the Stratix 10 family architecture, it targets high‑performance, bandwidth‑intensive applications that require large logic capacity, high on‑chip memory, and extensive I/O.

With 2,500,000 logic elements, 204,472,320 bits of on‑chip RAM, and 688 I/O pins, this industrial‑grade FPGA is suited for demanding networking, compute acceleration, and communications infrastructure designs that must operate across a −40 °C to 100 °C temperature range and within a 770 mV to 970 mV core supply window.

Key Features

• Core Architecture  Part of the Intel Stratix 10 GX family leveraging the Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) technology for enhanced core performance (family‑level documentation).
• Logic Capacity  2,500,000 logic elements to implement large-scale logic and control functions on a single device.
• On‑Chip Memory  204,472,320 total RAM bits of embedded memory for deep buffering, packet processing, and local data storage.
• I/O Density  688 device I/Os to support wide parallel interfaces, multi‑lane SERDES placements, and high‑pin‑count system connectivity.
• High‑Speed Transceiver Technology (Family Level)  Stratix 10 family features heterogeneous 3D SiP transceiver tiles and transceiver channels capable of high data rates (family documentation details transceiver capabilities and PMA/PCS features).
• Power and Voltage  Core voltage supply range of 770 mV to 970 mV for compatibility with Stratix 10 power domains.
• Package and Mounting  1760‑BBGA FCBGA package (1760‑FBGA, 42.5 × 42.5 mm) designed for surface‑mount assembly.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
• Regulatory  RoHS compliant.

Typical Applications

• High‑Performance Networking: Implement packet processing, switching and backplane interfacing where large logic capacity, significant on‑chip RAM, and dense I/O are required.
• Telecommunications Infrastructure: Support multi‑lane, high‑bandwidth transceiver interfaces and memory‑intensive buffering for telecom line cards and aggregation equipment.
• Data Center Acceleration: Deploy FPGA‑based accelerators for compute offload and custom processing pipelines leveraging the device's large logic and memory resources.
• Advanced Signal Processing: Realize complex DSP and dataflow architectures that require significant local memory and high I/O bandwidth.

Unique Advantages

• Massive Logic Capacity: 2,500,000 logic elements enable consolidation of large designs onto a single device, reducing board count and system complexity.
• Deep On‑Chip Memory: Over 204 million bits of RAM provide extensive buffering and state storage for high‑throughput pipelines and packet processing.
• High I/O Count: 688 I/Os allow flexible partitioning of interfaces and direct connection to multiple external devices without extensive multiplexing.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in industrial and ruggedized environments.
• Standard Surface‑Mount Package: 1760‑BBGA FCBGA (1760‑FBGA, 42.5 × 42.5 mm) offers a compact, manufacturable form factor for high‑density PCB designs.
• RoHS Compliance: Meets RoHS requirements for environmentally regulated manufacturing processes.

Why Choose 1SG250HN3F43I1VG?

The 1SG250HN3F43I1VG places a substantial amount of logic, memory, and I/O on a single industrial‑grade FPGA platform, making it suitable for complex, bandwidth‑heavy systems where consolidation, performance, and thermal robustness matter. Its Stratix 10 family lineage provides access to advanced architecture features and high‑speed transceiver technology documented for the family.

Designers targeting networking, telecom, data center acceleration, or advanced signal processing will find this device valuable for scaling designs, reducing BOM count, and supporting demanding thermal and voltage environments while remaining RoHS compliant.

Request a quote or submit a product inquiry to begin evaluating 1SG250HN3F43I1VG for your next high‑performance FPGA design.