1SG250HN3F43E3VG

The 1SG250HN3F43E3VG is an Intel Stratix® 10 GX field-programmable gate array (FPGA) device built on the Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) process. It targets advanced, high-bandwidth applications that demand scalable programmable logic, high-speed I/O and integrated high-performance compute resources.

This device combines large programmable capacity with extensive on-chip memory and multi-gigabit transceiver capability, delivering a platform for designs that require high core performance, high I/O density and tight power/area efficiency.

Key Features

• Core & architecture – Intel Hyperflex core architecture implemented in 14 nm tri-gate (FinFET) technology; family-level innovations report up to 2× core performance over the previous high-performance generation.
• Logic capacity – 2,500,000 logic elements (LEs) for large-scale programmable logic designs.
• On-chip memory – 204,472,320 total RAM bits with internal M20K SRAM memory blocks for large buffering and storage needs.
• I/O and package – 688 user I/Os; surface-mount 1760-BBGA (FCBGA) package with supplier package 1760-FBGA (42.5 × 42.5 mm).
• High-speed transceivers – Heterogeneous 3D SiP transceiver tiles with up to 96 full-duplex transceiver channels and transceiver data rates up to 28.3 Gbps for chip-to-chip, module and backplane links.
• Hard IP and interfaces – Family-level hard IP includes PCI Express Gen3 x16 and 10G Ethernet hard IP with forward error correction in every transceiver channel.
• DSP and compute – Variable-precision DSP blocks and family-level compute capability described up to 10 TFLOP with documented power-efficiency metrics.
• Memory controller support – Hard memory controllers and PHY supporting DDR4 rates up to 2666 Mbps per pin.
• Power and environmental – Voltage supply range 770 mV to 970 mV; operating temperature 0 °C to 100 °C; RoHS compliant; extended grade device.

Typical Applications

• High-performance networking – Multi-gigabit transceivers and integrated 10G/40G hard IP enable packet processing, switching and backplane interfaces.
• Telecom and optical transport – High-density I/O and FEC-capable transceivers support link-level reliability and high-throughput transport functions.
• Compute acceleration and DSP – Large DSP capacity and extensive on-chip RAM make the device suitable for signal processing, low-latency compute kernels and algorithm acceleration.
• Board- and module-level high-speed interfaces – Support for up to 28.3 Gbps transceiver rates and a high I/O count facilitates complex board-level connectivity and modular designs.

Unique Advantages

• High core performance: Hyperflex architecture and 14 nm FinFET implementation deliver family-reported 2× core performance versus the previous generation, enabling higher clocking and throughput.
• Massive programmable resources: 2.5 million logic elements combined with over 204 million RAM bits provide capacity for large, complex designs without immediate partitioning.
• Integrated high-speed connectivity: Up to 96 full-duplex transceiver channels and family-level support for PCIe Gen3 x16 and 10G Ethernet simplify integration of high-bandwidth links.
• Power-efficient process: 14 nm tri-gate technology and documented family-level power improvements (up to 70% lower power versus the previous generation) reduce thermal and power delivery constraints.
• Design-ready package and thermal range: 1760-BBGA (42.5 × 42.5 mm) surface-mount package, extended grade and 0 °C to 100 °C operating range support board-level implementation and qualification flow.
• Rich system IP: On-chip DSP blocks, M20K memory blocks and hard memory/PHY controllers accelerate time-to-market for compute- and memory-intensive functions.

Why Choose 1SG250HN3F43E3VG?

The 1SG250HN3F43E3VG combines large programmable capacity, significant on-chip memory and extensive high-speed connectivity in a single Stratix® 10 GX FPGA package. Its Hyperflex architecture on 14 nm FinFET technology provides a balance of core performance and power efficiency suited to demanding, high-bandwidth designs.

This device is well suited to engineering teams building network, telecom, compute acceleration and high-speed interface solutions that require scalable logic, abundant RAM and robust transceiver capabilities, while benefiting from Stratix® 10 family-level system IP and performance characteristics.

Request a quote or submit an inquiry for pricing and availability for the 1SG250HN3F43E3VG Stratix® 10 GX FPGA.