1SG250HN2F43I2VGAS

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2500000 1760-BBGA, FCBGA

Quantity 1,542 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs312500Number of Logic Elements/Cells2500000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits204472320

Overview of 1SG250HN2F43I2VGAS – Stratix® 10 GX FPGA, 2,500,000 logic elements, 688 I/O, 1760-BBGA

The 1SG250HN2F43I2VGAS is an Intel Stratix® 10 GX field programmable gate array (FPGA) supplied in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) package with surface-mount mounting. This industrial-grade device delivers 2,500,000 logic elements, 204,472,320 bits of on-chip RAM and 688 I/O pins, targeting advanced, high-bandwidth processing applications.

As part of the Stratix 10 family, this device leverages Intel family innovations—such as the Intel Hyperflex core architecture and 14 nm tri-gate process—to address demanding applications that require dense logic, substantial on-chip memory, and high-speed serial connectivity while operating across an industrial temperature range.

Key Features

  • Logic Capacity  2,500,000 logic elements (LEs) to implement large-scale custom logic, complex state machines, and system-level hardware acceleration.
  • On-Chip Memory  204,472,320 total RAM bits of embedded memory to support buffering, large lookup tables, and on-chip data storage.
  • I/O and Packaging  688 I/O pins in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) package, delivered as a surface-mount device for dense board-level integration.
  • Industrial Grade & Temperature Range  Rated for industrial operation from -40 °C to 100 °C to meet harsher environmental requirements.
  • Power and Core Voltage  Core supply operating range of 770 mV to 970 mV, enabling designs that require low-voltage core operation.
  • Stratix 10 Family Innovations  Family-level features include the Intel Hyperflex core architecture for increased core performance, Intel 14 nm tri-gate (FinFET) technology, heterogeneous 3D SiP transceiver tiles, and advanced internal memory block support such as M20K SRAM blocks.
  • High-Speed Connectivity (Family-Level)  Stratix 10 family transceiver capabilities include multi‑Gbps channels and PMA/PCS features; family documentation cites transceiver data rates up to 28.3 Gbps and hard PCIe Gen3 x16 and 10G/40G Ethernet IP available in the device family.

Typical Applications

  • High-Bandwidth Networking & Telecom  Use the device’s large logic capacity, extensive I/O, and family transceiver capabilities to implement packet processing, switch/router interfaces, and line-rate protocol acceleration.
  • Data Center & Acceleration  Deploy as a hardware accelerator or I/O offload engine where high logic density and large on-chip memory enable low-latency data paths and complex compute kernels.
  • High-Speed I/O and Interface Bridging  Leverage the 688 I/O pins and family-level transceiver/PHY options for protocol bridging, backplane interfaces, and module-level high-speed serial connectivity.
  • SoC and Embedded Processing (Family Variants)  Stratix 10 family SoC variants include an embedded hard processor system; use hardware/software partitioning to combine application-class processing with programmable logic acceleration.

Unique Advantages

  • High Logic Density: 2,500,000 logic elements enable integration of complex, system-level functions on a single device, reducing external component count.
  • Substantial On-Chip Memory: Over 204 million bits of RAM support large buffering and table-driven algorithms without relying on external memory.
  • Extensive I/O Surface: 688 I/O pins in a compact 1760-FBGA package facilitate rich connectivity and dense board-level routing for multi-protocol designs.
  • Industrial Reliability: Specified for -40 °C to 100 °C operation, suitable for deployed systems that must operate across wide ambient temperatures.
  • Low-Voltage Core Operation: Core supply range of 770 mV to 970 mV supports power-optimized designs and tighter power budgets.
  • Family-Level Performance Innovations: Access to Stratix 10 family technologies—Intel Hyperflex architecture, 14 nm tri-gate process, and heterogeneous 3D SiP transceiver tiles—provides an advanced FPGA platform for demanding designs.

Why Choose 1SG250HN2F43I2VGAS?

The 1SG250HN2F43I2VGAS brings together high logic capacity, significant on-chip memory, and broad I/O in an industrial-grade Stratix 10 GX FPGA. It is positioned for system designs that require dense programmable logic, substantial local memory, and robust I/O options while operating across an extended temperature range.

Choosing this part lets engineering teams leverage Stratix 10 family innovations—such as the Hyperflex core architecture and advanced transceiver options—while keeping board-level integration compact with a 1760-FBGA package. It is well suited for customers building high-bandwidth networking, data center acceleration, and interface-intensive systems that benefit from a high-capacity, industrial-grade FPGA platform.

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