1SG250HN2F43I2VGAS
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2500000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,542 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 312500 | Number of Logic Elements/Cells | 2500000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 204472320 |
Overview of 1SG250HN2F43I2VGAS – Stratix® 10 GX FPGA, 2,500,000 logic elements, 688 I/O, 1760-BBGA
The 1SG250HN2F43I2VGAS is an Intel Stratix® 10 GX field programmable gate array (FPGA) supplied in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) package with surface-mount mounting. This industrial-grade device delivers 2,500,000 logic elements, 204,472,320 bits of on-chip RAM and 688 I/O pins, targeting advanced, high-bandwidth processing applications.
As part of the Stratix 10 family, this device leverages Intel family innovations—such as the Intel Hyperflex core architecture and 14 nm tri-gate process—to address demanding applications that require dense logic, substantial on-chip memory, and high-speed serial connectivity while operating across an industrial temperature range.
Key Features
- Logic Capacity 2,500,000 logic elements (LEs) to implement large-scale custom logic, complex state machines, and system-level hardware acceleration.
- On-Chip Memory 204,472,320 total RAM bits of embedded memory to support buffering, large lookup tables, and on-chip data storage.
- I/O and Packaging 688 I/O pins in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) package, delivered as a surface-mount device for dense board-level integration.
- Industrial Grade & Temperature Range Rated for industrial operation from -40 °C to 100 °C to meet harsher environmental requirements.
- Power and Core Voltage Core supply operating range of 770 mV to 970 mV, enabling designs that require low-voltage core operation.
- Stratix 10 Family Innovations Family-level features include the Intel Hyperflex core architecture for increased core performance, Intel 14 nm tri-gate (FinFET) technology, heterogeneous 3D SiP transceiver tiles, and advanced internal memory block support such as M20K SRAM blocks.
- High-Speed Connectivity (Family-Level) Stratix 10 family transceiver capabilities include multi‑Gbps channels and PMA/PCS features; family documentation cites transceiver data rates up to 28.3 Gbps and hard PCIe Gen3 x16 and 10G/40G Ethernet IP available in the device family.
Typical Applications
- High-Bandwidth Networking & Telecom Use the device’s large logic capacity, extensive I/O, and family transceiver capabilities to implement packet processing, switch/router interfaces, and line-rate protocol acceleration.
- Data Center & Acceleration Deploy as a hardware accelerator or I/O offload engine where high logic density and large on-chip memory enable low-latency data paths and complex compute kernels.
- High-Speed I/O and Interface Bridging Leverage the 688 I/O pins and family-level transceiver/PHY options for protocol bridging, backplane interfaces, and module-level high-speed serial connectivity.
- SoC and Embedded Processing (Family Variants) Stratix 10 family SoC variants include an embedded hard processor system; use hardware/software partitioning to combine application-class processing with programmable logic acceleration.
Unique Advantages
- High Logic Density: 2,500,000 logic elements enable integration of complex, system-level functions on a single device, reducing external component count.
- Substantial On-Chip Memory: Over 204 million bits of RAM support large buffering and table-driven algorithms without relying on external memory.
- Extensive I/O Surface: 688 I/O pins in a compact 1760-FBGA package facilitate rich connectivity and dense board-level routing for multi-protocol designs.
- Industrial Reliability: Specified for -40 °C to 100 °C operation, suitable for deployed systems that must operate across wide ambient temperatures.
- Low-Voltage Core Operation: Core supply range of 770 mV to 970 mV supports power-optimized designs and tighter power budgets.
- Family-Level Performance Innovations: Access to Stratix 10 family technologies—Intel Hyperflex architecture, 14 nm tri-gate process, and heterogeneous 3D SiP transceiver tiles—provides an advanced FPGA platform for demanding designs.
Why Choose 1SG250HN2F43I2VGAS?
The 1SG250HN2F43I2VGAS brings together high logic capacity, significant on-chip memory, and broad I/O in an industrial-grade Stratix 10 GX FPGA. It is positioned for system designs that require dense programmable logic, substantial local memory, and robust I/O options while operating across an extended temperature range.
Choosing this part lets engineering teams leverage Stratix 10 family innovations—such as the Hyperflex core architecture and advanced transceiver options—while keeping board-level integration compact with a 1760-FBGA package. It is well suited for customers building high-bandwidth networking, data center acceleration, and interface-intensive systems that benefit from a high-capacity, industrial-grade FPGA platform.
Request a quote or submit an inquiry to receive pricing and availability information for 1SG250HN2F43I2VGAS.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018