1SG250HN2F43E2VG

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2500000 1760-BBGA, FCBGA

Quantity 402 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs312500Number of Logic Elements/Cells2500000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits204472320

Overview of 1SG250HN2F43E2VG – Stratix® 10 GX FPGA, 2,500,000 logic elements, 688 I/O, 1760-BBGA

The 1SG250HN2F43E2VG is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) in a 1760-BBGA (FCBGA) package. It delivers high logic capacity and extensive I/O in a surface-mount package for advanced, bandwidth- and compute-intensive designs.

Built on the Stratix 10 GX family architecture, the device targets applications that require large on-chip memory, high-density programmable logic, high-speed transceivers, and system-level integration enabled by the Stratix 10 series architecture and features.

Key Features

  • Core Architecture  Intel Stratix 10 GX family architecture with Hyperflex core innovations as detailed in the device overview.
  • Logic Capacity  2,500,000 logic elements to support large, complex FPGA designs and high-density implementations.
  • On‑Chip Memory  204,472,320 total RAM bits and support for M20K internal SRAM memory blocks as described in the device family overview.
  • I/O and Packages  688 I/O pins in a 1760-BBGA (FCBGA) package; supplier device package listed as 1760-FBGA (42.5×42.5). Surface mount mounting type.
  • Transceivers and Hard IP  Series-level features include heterogeneous 3D SiP transceiver tiles and hard IP such as PCI Express Gen3 and 10G Ethernet described in the Stratix 10 GX overview.
  • DSP and Compute  Variable precision DSP blocks and high compute capability are part of the Stratix 10 family feature set referenced in the datasheet.
  • Power and Supply  Core voltage supply range specified at 770 mV to 970 mV for device operation.
  • Operating Range & Grade  Extended grade device with an operating temperature range of 0°C to 100°C.

Typical Applications

  • High‑Speed Networking  Leverage large logic capacity, on-chip memory, and the Stratix 10 GX transceiver and Ethernet hard IP capabilities for switching, routing, and line-rate packet processing.
  • Data Center Acceleration  Use the device’s high logic density and DSP resources to implement compute‑intensive accelerators and offload functions in cloud and hyperscale systems.
  • Telecommunications & Backplane Systems  High I/O count and series transceiver features support backplane interfaces, protocol processing, and multi‑lane high-speed links.
  • Advanced Signal Processing  Large on-chip memory and variable precision DSP blocks enable real-time processing for comms, radar, and signal-chain designs.

Unique Advantages

  • High Logic Density: 2,500,000 logic elements provide capacity for large-scale, multi-function FPGA implementations.
  • Extensive On‑Chip Memory: 204,472,320 total RAM bits support complex buffering, caching, and local data processing without immediate external memory dependence.
  • Broad I/O and Packaging: 688 I/O pins in a 1760-BBGA (1760-FBGA 42.5×42.5) surface-mount package enable dense system integration and high pin-count interfaces.
  • Series-Level High‑Speed Features: Stratix 10 GX family transceiver technology and hard IP options (including PCIe and high-speed Ethernet) provide roadmap-aligned capabilities for high-bandwidth systems.
  • Power-Conscious Core Operation: Core supply range of 770 mV–970 mV facilitates low-voltage operation consistent with the device family power architecture.
  • Extended Temperature Grade: Specified operating range from 0°C to 100°C for deployments requiring extended commercial temperature support.

Why Choose 1SG250HN2F43E2VG?

The 1SG250HN2F43E2VG brings substantial programmable logic capacity, large on-chip memory, and a high I/O count in a compact 1760-BBGA package. It is well suited to designers building bandwidth- and compute-intensive systems who need the Stratix 10 GX family’s architectural advantages and the series-level hard IP and transceiver capabilities.

Choosing this device benefits teams that require scalability within the Stratix 10 family, robust on-chip resources for complex algorithms, and a package that supports high-density board integration. The extended grade and defined core voltage range make it straightforward to plan thermal and power delivery in system designs.

Request a quote or submit an inquiry to learn more about pricing, availability, and integration support for the 1SG250HN2F43E2VG.

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