1SG250HN2F43E2VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2500000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 402 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 312500 | Number of Logic Elements/Cells | 2500000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 204472320 |
Overview of 1SG250HN2F43E2VG – Stratix® 10 GX FPGA, 2,500,000 logic elements, 688 I/O, 1760-BBGA
The 1SG250HN2F43E2VG is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) in a 1760-BBGA (FCBGA) package. It delivers high logic capacity and extensive I/O in a surface-mount package for advanced, bandwidth- and compute-intensive designs.
Built on the Stratix 10 GX family architecture, the device targets applications that require large on-chip memory, high-density programmable logic, high-speed transceivers, and system-level integration enabled by the Stratix 10 series architecture and features.
Key Features
- Core Architecture Intel Stratix 10 GX family architecture with Hyperflex core innovations as detailed in the device overview.
- Logic Capacity 2,500,000 logic elements to support large, complex FPGA designs and high-density implementations.
- On‑Chip Memory 204,472,320 total RAM bits and support for M20K internal SRAM memory blocks as described in the device family overview.
- I/O and Packages 688 I/O pins in a 1760-BBGA (FCBGA) package; supplier device package listed as 1760-FBGA (42.5×42.5). Surface mount mounting type.
- Transceivers and Hard IP Series-level features include heterogeneous 3D SiP transceiver tiles and hard IP such as PCI Express Gen3 and 10G Ethernet described in the Stratix 10 GX overview.
- DSP and Compute Variable precision DSP blocks and high compute capability are part of the Stratix 10 family feature set referenced in the datasheet.
- Power and Supply Core voltage supply range specified at 770 mV to 970 mV for device operation.
- Operating Range & Grade Extended grade device with an operating temperature range of 0°C to 100°C.
Typical Applications
- High‑Speed Networking Leverage large logic capacity, on-chip memory, and the Stratix 10 GX transceiver and Ethernet hard IP capabilities for switching, routing, and line-rate packet processing.
- Data Center Acceleration Use the device’s high logic density and DSP resources to implement compute‑intensive accelerators and offload functions in cloud and hyperscale systems.
- Telecommunications & Backplane Systems High I/O count and series transceiver features support backplane interfaces, protocol processing, and multi‑lane high-speed links.
- Advanced Signal Processing Large on-chip memory and variable precision DSP blocks enable real-time processing for comms, radar, and signal-chain designs.
Unique Advantages
- High Logic Density: 2,500,000 logic elements provide capacity for large-scale, multi-function FPGA implementations.
- Extensive On‑Chip Memory: 204,472,320 total RAM bits support complex buffering, caching, and local data processing without immediate external memory dependence.
- Broad I/O and Packaging: 688 I/O pins in a 1760-BBGA (1760-FBGA 42.5×42.5) surface-mount package enable dense system integration and high pin-count interfaces.
- Series-Level High‑Speed Features: Stratix 10 GX family transceiver technology and hard IP options (including PCIe and high-speed Ethernet) provide roadmap-aligned capabilities for high-bandwidth systems.
- Power-Conscious Core Operation: Core supply range of 770 mV–970 mV facilitates low-voltage operation consistent with the device family power architecture.
- Extended Temperature Grade: Specified operating range from 0°C to 100°C for deployments requiring extended commercial temperature support.
Why Choose 1SG250HN2F43E2VG?
The 1SG250HN2F43E2VG brings substantial programmable logic capacity, large on-chip memory, and a high I/O count in a compact 1760-BBGA package. It is well suited to designers building bandwidth- and compute-intensive systems who need the Stratix 10 GX family’s architectural advantages and the series-level hard IP and transceiver capabilities.
Choosing this device benefits teams that require scalability within the Stratix 10 family, robust on-chip resources for complex algorithms, and a package that supports high-density board integration. The extended grade and defined core voltage range make it straightforward to plan thermal and power delivery in system designs.
Request a quote or submit an inquiry to learn more about pricing, availability, and integration support for the 1SG250HN2F43E2VG.

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