1SG250HN2F43E1VG

The 1SG250HN2F43E1VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-BBGA (FCBGA) package. It combines a high-capacity logic fabric with large on-chip memory and a broad I/O complement to address advanced, high‑performance applications that require intensive processing and high bandwidth.

Built on the Stratix 10 family architecture, this device leverages the Hyperflex core innovations described in the device overview to deliver step-change core performance and power efficiency for demanding communications, data center, and compute-accelerator designs.

Key Features

• Logic Fabric — 2,500,000 logic elements and 312,500 LABs/CLBs provide a very large programmable fabric for complex logic, control and packet-processing implementations.
• On‑Chip Memory — 204,472,320 total RAM bits of embedded memory support large buffering, packet queues and on‑chip data structures.
• I/O and Packaging — 688 user I/Os in a 1760‑BBGA FCBGA package (supplier device package 1760‑FBGA, 42.5 × 42.5 mm) enable high pin-count board designs and dense routing for multi‑lane interfaces.
• Power and Voltage — Core supply range from 770 mV to 970 mV to match system power‑delivery designs and optimize performance/power tradeoffs.
• Operating Range and Grade — Extended grade with an operating temperature range of 0 °C to 100 °C for demanding commercial and enterprise environments.
• Stratix 10 Family Innovations — Family-level features include the Intel Hyperflex core architecture, FinFET process advantages, and heterogeneous transceiver/SiP technologies as described in the device overview.
• Standards and Compliance — RoHS compliant.

Typical Applications

• High‑performance Networking — Implement packet processors, switch fabrics and line cards that require large logic counts, on-chip buffering and many high‑speed I/Os.
• Data Center Acceleration — Offload compute kernels and implement custom accelerators where extensive logic and memory resources are needed.
• High‑speed Communications — Support multi‑lane transceiver implementations and high-density I/O for backplane and module interfaces.
• Signal Processing and DSP — Deploy large-scale pipelined and parallel DSP chains using the device’s substantial logic and embedded RAM.

Unique Advantages

• Very Large Logic Capacity: 2.5 million logic elements allow integration of complex system functions into a single device, reducing board-level component count.
• Massive On‑Chip Memory: Over 204 million bits of embedded RAM enable large buffers and stateful processing without relying solely on external memory.
• High I/O Density: 688 I/Os and a 1760‑BBGA package support dense multi‑lane interfaces and flexible board routing for complex connectivity.
• Power‑Flexible Core Supply: A 770 mV–970 mV core voltage range gives designers headroom to tune performance versus power.
• Extended Operating Grade: Rated 0 °C to 100 °C to meet enterprise and telecom thermal environments.
• Backed by Stratix 10 Family Technology: Device-level benefits align with the Stratix 10 family architecture and Hyperflex innovations documented in the device overview.

Why Choose 1SG250HN2F43E1VG?

The 1SG250HN2F43E1VG positions itself for designs that demand very large programmable logic capacity, substantial on‑chip memory, and high I/O density in a single FPGA package. Its extended-grade rating and defined core voltage range make it suitable for enterprise and communications equipment where performance, integration and predictable thermal operation matter.

For teams building high‑throughput networking, compute acceleration or advanced signal‑processing systems, this Stratix 10 GX device provides the raw resources required to consolidate functions, reduce board-level complexity and accelerate time to market—backed by the Stratix 10 family documentation and ecosystem.

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