1SG250HN1F43I2VG

The 1SG250HN1F43I2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) supplied in a 1760-BBGA (FCBGA) package. Built on the Stratix 10 family architecture, the device is designed for high-bandwidth, high-performance applications that require large logic capacity, extensive on-chip memory, and dense I/O.

Targeted at industrial-grade systems, this device combines Intel Stratix 10 family innovations—such as the Hyperflex core architecture and advanced transceiver capabilities described for the family—with the specific hardware resources listed for this part to support demanding compute, networking, and I/O-centric designs.

Key Features

• Logic Capacity  2,500,000 logic elements provide substantial programmable fabric for complex logic, control and data-path designs.
• On‑Chip Memory  204,472,320 total RAM bits for large buffers, packet buffering, and embedded data storage.
• I/O Density  688 user I/O pins to support dense external interfaces and parallel connectivity.
• Family Architecture Highlights  Based on the Intel Stratix 10 GX family overview: Intel Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) technology as described for the family.
• Transceiver & High‑Speed I/O  Stratix 10 family transceiver features and high-speed I/O capabilities are part of the device family architecture as described in the device overview.
• Power Supply  Core voltage range 770 mV to 970 mV to match modern low-voltage FPGA power domains.
• Package & Mounting  1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) surface-mount package for high-density board integration.
• Operating Range  Industrial grade with operating temperature from −40 °C to 100 °C and RoHS compliance.

Typical Applications

• High‑performance networking  Use for packet processing, protocol offload, and line-rate interfacing where large logic capacity and extensive I/O are required.
• Data center acceleration  Implements custom acceleration kernels, data-path engines, and buffering using the device’s logic and on-chip memory.
• Telecommunications and backplane systems  Supports complex PHY and protocol implementations leveraging the Stratix 10 family’s transceiver and I/O capabilities.
• Instrumentations and test equipment  Enables flexible, high-channel-count signal processing and real-time data handling with large RAM and abundant I/O.

Unique Advantages

• Large programmable fabric: 2,500,000 logic elements provide headroom for large-scale state machines, pipelines, and custom accelerators.
• Substantial embedded memory: 204,472,320 RAM bits reduce external memory dependence for buffering and high-throughput data paths.
• High I/O count: 688 I/O pins support complex multi‑lane interfaces, wide parallel buses, and dense sensor or peripheral connectivity.
• Industrial temperature rating: −40 °C to 100 °C operation suits deployments in industrial and harsh-environment systems.
• Compact, high‑density package: 1760-BBGA (42.5 × 42.5 mm) package enables high integration on space-constrained PCBs.
• RoHS compliant: Meets regulatory requirements for lead‑free manufacturing processes.

Why Choose 1SG250HN1F43I2VG?

This Stratix 10 GX device combines very large programmable resources, extensive on-chip RAM, and a high I/O count in an industrial‑rated, RoHS‑compliant FCBGA package. It is positioned for engineers designing high-bandwidth, compute- and I/O-intensive systems where integration density and robust operating range are priorities.

Choose the 1SG250HN1F43I2VG for designs that require scalable logic capacity and embedded memory, and for applications that benefit from the Stratix 10 family architecture and high-density package options while maintaining industrial temperature operation.

Request a quote or submit a sales inquiry to receive pricing, availability, and delivery information for the 1SG250HN1F43I2VG.