1SG250HN1F43I1VG

The 1SG250HN1F43I1VG is an Intel Stratix® 10 GX high-performance FPGA in a 1760-BBGA (FCBGA) package, offered in an industrial-grade configuration for surface-mount applications. It delivers substantial logic capacity and on-chip memory for complex, bandwidth-intensive designs.

As part of the Stratix® 10 family, device-level and family-level innovations include the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) process technology, aimed at addressing high-bandwidth compute, networking, and signal-processing use cases while supporting low-voltage core operation.

Key Features

• Core Architecture  Family-level Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology for high-performance FPGA fabric and efficient core operation.
• Logic Capacity  2,500,000 logic elements for implementing large-scale digital designs and complex algorithms.
• On-chip Memory  204,472,320 total RAM bits to support large buffering, caching, and state storage requirements.
• I/O and Package  688 I/O pins in a 1760-BBGA (FCBGA) package; supplier package size 1760-FBGA (42.5×42.5 mm) suitable for dense board-level integration.
• Power and Voltage  Core voltage supply range of 770 mV to 970 mV to match low-voltage system designs.
• Thermal and Mounting  Industrial operating temperature range of −40 °C to 100 °C and surface-mount package for industrial applications.
• Family-Level I/O & Transceiver Features  Stratix® 10 family innovations include high-speed heterogeneous 3D SiP transceiver tiles and transceiver data rates up to 28.3 Gbps (family capability) for demanding serial links and backplane interfaces.
• Standards and Compliance  RoHS compliant material declaration.

Typical Applications

• High-Speed Networking & Communications  Used where high logic density and family-level transceiver capability are required for packet processing, switch/fabric implementations, and line-rate processing.
• Data Center Acceleration  Deploy FPGA fabric and large on-chip RAM for hardware acceleration of compute-intensive workloads and inline data processing.
• High-Performance Signal Processing  Suitable for complex DSP pipelines and real-time processing requiring extensive logic resources and memory.
• Advanced Prototyping and Custom SoC Integration  Leverage Stratix® 10 family architecture for system-level integration and high-density prototyping in industrial environments.

Unique Advantages

• High Logic Density: 2,500,000 logic elements enable large, complex designs without partitioning across multiple devices.
• Large On-Chip Memory: Over 204 million bits of RAM support substantial buffering and stateful processing inside the FPGA fabric.
• Industrial-Grade Operation: Rated for −40 °C to 100 °C operation to meet industrial environmental requirements.
• Compact High-Pin Package: 1760-BBGA (42.5×42.5 mm) delivers 688 I/Os in a compact surface-mount form factor for dense PCB layouts.
• Family-Level Performance Features: Access to Stratix® 10 innovations such as Hyperflex architecture and high-speed transceiver capabilities for scalable system design.
• Low-Voltage Core: Operates within a 770 mV to 970 mV supply window to align with modern low-voltage power domains.

Why Choose 1SG250HN1F43I1VG?

The 1SG250HN1F43I1VG combines very high logic capacity, substantial on-chip memory, and a high I/O count in an industrial-grade Stratix® 10 GX package, making it well suited for demanding networking, acceleration, and signal processing designs. Its family-level architectural innovations and 14 nm FinFET foundation provide a platform for high-throughput, complex implementations while supporting low-voltage operation.

This device is ideal for engineering teams and system designers seeking a scalable, high-density FPGA solution that integrates into industrial-temperature systems and leverages the Stratix® 10 family capabilities for advanced interface and processing requirements.

Request a quote or submit an inquiry for part number 1SG250HN1F43I1VG to discuss pricing, lead time, and volume options.