1SG250HN2F43E2LG

The 1SG250HN2F43E2LG is a Stratix® 10 GX field programmable gate array (FPGA) packaged in a 1760-BBGA FCBGA (1760-FBGA, 42.5 × 42.5 mm) surface-mount package. It delivers a high-capacity programmable fabric with 2,500,000 logic elements, abundant on-chip memory, and 688 general-purpose I/Os for high-bandwidth and computation-intensive designs.

Built on the Stratix 10 family architecture, this device targets advanced applications that require large logic capacity, extensive RAM resources, and flexible I/O in a single FPGA solution.

Key Features

• Logic Capacity: 2,500,000 logic elements (logic cells) for large-scale programmable logic and complex design integration.
• On-chip Memory: 204,472,320 total RAM bits to support large buffers, scratchpads, and memory-intensive algorithms.
• I/O Density: 688 I/O pins to accommodate wide external interfaces, high-pin-count memory buses, and multiple peripheral connections.
• Package & Mounting: 1760-BBGA, FCBGA package (supplier package: 1760-FBGA, 42.5 × 42.5 mm) with surface-mount compatibility for dense board-level integration.
• Power Supply: Core voltage range 820 mV to 880 mV, enabling integration with modern low-voltage power architectures.
• Operating Range & Grade: Extended grade with an operating temperature range of 0 °C to 100 °C, suitable for a wide set of commercial and enterprise applications.
• Compliance: RoHS compliant, meeting common lead-free manufacturing requirements.
• Stratix 10 Family Innovations: Leverages Stratix 10 family architecture elements such as the Intel Hyperflex core architecture and Intel 14 nm tri-gate technology described in the device family overview.

Typical Applications

• High-performance Networking: Use the device for packet processing, switch/router logic, and high-density interface aggregation where large logic capacity and many I/Os are required.
• Compute Acceleration: Deploy as a hardware accelerator for signal processing or algorithm offload that requires substantial on-chip RAM and logic resources.
• Telecommunications & Optical Transport: Implement interface logic, protocol handling, and buffering for communication systems that benefit from extensive programmable fabric and I/O bandwidth.
• Data Center & Storage: Integrate custom control, data-path processing, and host interfaces that demand high logic density and memory capacity.

Unique Advantages

• Massive Programmable Fabric: 2.5 million logic elements enable consolidation of complex subsystems into a single FPGA, reducing board-level complexity.
• Large On-chip Memory: Over 204 million bits of RAM reduce dependency on external memory for many buffering and caching needs, improving latency and throughput.
• High I/O Count: 688 I/Os simplify integration of parallel interfaces, multi-channel SERDES PHYs, and wide memory buses without external multiplexing.
• High-density Packaging: The 1760-BBGA package provides a compact, board-friendly footprint for designs that require maximum routing density and signal count.
• Designed for Advanced Designs: Built on Stratix 10 family architecture, providing access to documented family-level innovations and feature sets relevant to high-performance FPGA applications.

Why Choose 1SG250HN2F43E2LG?

The 1SG250HN2F43E2LG positions itself as a high-capacity Stratix 10 GX FPGA for customers needing significant logic resources, extensive on-chip memory, and large I/O counts in a single surface-mount package. Its extended operating range and RoHS compliance make it suitable for demanding enterprise and communications equipment where reliability and manufacturability are priorities.

Engineering teams targeting high-bandwidth networking, compute acceleration, and complex protocol implementations will find this device well suited for consolidating functionality, simplifying system design, and leveraging the Stratix 10 family architecture and documentation during development.

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