1SG250HN2F43I2LG

The 1SG250HN2F43I2LG is an Intel Stratix® 10 GX field‑programmable gate array (FPGA) in a 1760‑BBGA FCBGA package. It delivers 2,500,000 logic elements and substantial on‑chip memory to address advanced, high‑bandwidth processing requirements.

Built on the Stratix 10 GX family architecture, the device targets demanding applications that require large logic capacity, abundant RAM, high I/O density, and industrial‑grade operating range — enabling complex networking, compute acceleration, and signal‑processing designs.

Key Features

• Core Architecture  Part of the Intel Stratix 10 GX family with the Hyperflex core architecture described in the device overview to deliver improved core performance for advanced designs.
• Logic Capacity  2,500,000 logic elements for implementing large, high‑density logic designs and complex custom accelerators.
• On‑Chip Memory  204,472,320 total RAM bits of internal memory to support large buffering, lookup tables, and shared data storage within the FPGA fabric.
• I/O Density  688 user I/O pins, providing a high channel count for routing to external peripherals, memory interfaces, and high‑speed links.
• Family‑Level Transceiver and IP Innovations  Stratix 10 GX family documentation highlights heterogeneous 3D SiP transceiver tiles, high‑speed transceiver capability, and hard IP blocks (for example PCIe and 10G Ethernet in family overviews) suitable for bandwidth‑intensive systems.
• Power and Voltage  Core voltage supply range of 820 mV to 880 mV, enabling designers to plan accurate power delivery for the device.
• Package and Mounting  1760‑BBGA (1760‑FBGA, 42.5 × 42.5 mm) FCBGA package, surface‑mount mounting for compact, board‑level integration.
• Industrial Grade Operation  Rated operating temperature from −40 °C to 100 °C for use in industrial temperature environments.
• Compliance  RoHS‑compliant to support modern environmental and manufacturing requirements.

Typical Applications

• High‑speed Networking and Switching  High logic count, large RAM, and family transceiver capabilities support packet processing, forwarding engines, and protocol offload in network equipment.
• Data Center Acceleration  Large FPGA fabric and memory resources make the device suitable for hardware acceleration tasks, complex data path processing, and custom compute offloads.
• Telecommunications Infrastructure  High I/O count and Stratix 10 GX family communications IP enable applications in line cards, fronthaul/ backhaul processing, and transport equipment.
• Signal Processing and DSP  Extensive logic and on‑chip RAM support implementation of high‑throughput DSP pipelines, filters, and real‑time processing chains.

Unique Advantages

• Massive Logic and Memory Capacity:  2,500,000 logic elements and over 204 million RAM bits allow dense algorithm implementation without external logic partitioning.
• High I/O Count for System Integration:  688 I/O pins provide flexibility to connect multiple external interfaces, memories, and high‑speed PHYs directly to the FPGA fabric.
• Industrial Temperature Support:  −40 °C to 100 °C operating range enables deployment in industrial environments where extended temperature tolerance is required.
• Compact, High‑Pin Package:  1760‑BBGA FCBGA (42.5 × 42.5 mm) provides a dense pinout in a board‑level friendly form factor for space‑constrained systems.
• Designed for Bandwidth‑Intensive Designs:  As part of the Stratix 10 GX family, the device benefits from family innovations targeted at high bandwidth and processing performance for advanced applications.
• Regulatory and Manufacturing Compliance:  RoHS compliance aligns with contemporary electronics manufacturing and environmental standards.

Why Choose 1SG250HN2F43I2LG?

The 1SG250HN2F43I2LG is positioned for designers needing a large FPGA fabric with significant on‑chip memory and high I/O density in an industrial‑rated package. Its inclusion in the Intel Stratix 10 GX family provides access to family‑level architectural and transceiver innovations aimed at high‑performance, bandwidth‑focused applications.

This device is well suited for engineers building networking, telecommunications, data center acceleration, or advanced signal‑processing systems who require scalable logic resources, substantial embedded RAM, and an industrial operating range — all in a compact FCBGA package.

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