1SG250HN3F43E1VG

The 1SG250HN3F43E1VG is an Intel Stratix® 10 GX family FPGA configured for high-density, high-bandwidth applications. It combines the Stratix 10 GX architecture innovations with a large logic fabric, substantial embedded RAM, and broad I/O to address demanding processing, networking and acceleration tasks.

Designed for system designs that require significant logic capacity, on-chip memory, and high pin-count packaging, this device delivers an integrated platform for advanced communications, compute acceleration, and data-forwarding functions while operating within a low-voltage core range.

Key Features

• Core Architecture  Part of the Intel Stratix 10 GX family, which incorporates the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) process technology as described in the device family overview.
• Logic Capacity  2,500,000 logic elements, providing substantial programmable fabric for complex designs and large-scale logic integration.
• On-Chip Memory  204,472,320 total RAM bits to support large buffering, lookup tables, and on-chip data storage for compute and networking workloads.
• I/O and Connectivity  688 user I/O pins to support wide external interfaces and high-bandwidth connectivity in multi-lane systems.
• Advanced Transceiver and IP (Family-level)  Stratix 10 GX family documentation highlights heterogeneous 3D SiP transceiver tiles, high-performance transceivers and hard IP such as PCI Express Gen3; these family innovations are part of the device family architecture.
• Power and Voltage  Core supply range from 770 mV to 970 mV, enabling low-voltage operation consistent with the Stratix 10 GX family power architecture.
• Package & Mounting  1760-BBGA, FCBGA package (supplier package: 1760-FBGA, 42.5 × 42.5 mm) in a surface-mount format for high I/O density and board-level integration.
• Temperature & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C suitable for many commercial and extended-temperature deployments.
• Regulatory  RoHS compliant.

Typical Applications

• High-Performance Networking  Leverage large logic capacity and high I/O count for packet processing, line-card functions, and forwarding engines.
• Data Center Acceleration  Implement compute offload, custom accelerators, and protocol handling using extensive on-chip RAM and logic resources.
• Telecommunications Infrastructure  Deploy in routing, switching, and transport equipment that benefit from the Stratix 10 GX family’s high-bandwidth transceiver and IP capabilities.
• Compute & DSP Workloads  Support intensive signal processing and arithmetic-heavy pipelines using abundant logic and embedded memory.

Unique Advantages

• High logic density: 2,500,000 logic elements enable consolidation of large, complex designs into a single device, reducing board-level component count.
• Substantial on-chip RAM: Over 204 million bits of embedded RAM support deep buffering and high-throughput data paths without relying solely on external memory.
• Broad I/O capability: 688 I/O pins provide flexibility for multi-protocol interfaces and wide parallel busses.
• Low-voltage core operation: 770 mV to 970 mV supply range supports efficient core power management strategies.
• High-density BGA packaging: 1760-ball BGA (42.5 × 42.5 mm) supports the device’s pin count and routing needs while enabling surface-mount assembly.
• Stratix 10 GX family innovations: Family-level features such as the Hyperflex architecture and 14 nm FinFET process provide a modern FPGA foundation for performance and power efficiency.

Why Choose 1SG250HN3F43E1VG?

The 1SG250HN3F43E1VG positions itself for applications that demand significant programmable logic, large on-chip memory, and wide I/O connectivity within the Stratix 10 GX device family. Its combination of 2.5 million logic elements, more than 204 million RAM bits, and 688 I/O make it suitable for consolidating complex functions and reducing system-level BOM.

Engineers designing high-bandwidth, compute-intensive systems will find this device’s package, voltage range, and extended temperature grade align with robust board-level integration and operational requirements. Backed by the Stratix 10 GX family architecture, it delivers a scalable platform for advanced networking, acceleration, and processing designs.

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