1SG250HN3F43E2VG

The 1SG250HN3F43E2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) offered in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) package. It provides high logic capacity and large on-chip RAM, combined with a low-voltage core supply and extended temperature grade for demanding system designs.

Designed for advanced, bandwidth- and compute-intensive applications, this device brings Intel Stratix 10 family innovations—such as the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology—into designs that require significant logic, memory, and I/O resources.

Key Features

• Logic Capacity  Provides 2,500,000 logic elements, enabling large-scale FPGA implementations and complex system integration on a single device.
• On‑Chip Memory  Includes 204,472,320 bits of total RAM to support large buffering, packet processing, and data‑centric algorithms.
• I/O and Packaging  Features 688 I/O pins in a 1760-BBGA FCBGA package (supplier device package: 1760-FBGA, 42.5 × 42.5 mm) for dense board routing and wide external connectivity.
• Core Technology  Built on Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) process technology as detailed in the Stratix 10 GX family overview.
• Power and Supply  Specified core voltage range of 770 mV to 970 mV to match modern low-voltage power architectures.
• Operating Range and Grade  Extended-grade device rated for operation from 0 °C to 100 °C.
• Family-Level High-Speed Features  Part of the Stratix 10 GX family that includes high-performance transceiver and DSP capabilities described in the device overview.

Typical Applications

• High‑Performance Networking  Use the device's large logic and memory resources to implement packet processing, switching engines, and custom protocol offload functions.
• Data Center Acceleration  Leverage substantial on‑chip RAM and compute fabric for hardware acceleration workloads and inline data transformation.
• Telecommunications and Backplane Systems  Employ the Stratix 10 GX family transceiver and fabric features for high-bandwidth chip‑to‑chip and backplane interconnect solutions.

Unique Advantages

• Large-Scale Integration:  2,500,000 logic elements and over 204 million bits of RAM reduce the need for external logic and memory, simplifying system BOM.
• Dense I/O Footprint:  688 I/O pins in a 1760-FBGA package support complex board-level interfaces and multiple high-speed links.
• Modern Process and Architecture:  Built on 14 nm FinFET technology with the Hyperflex core architecture for improved core performance as described in the Stratix 10 GX family overview.
• Low-Voltage Core Support:  Core supply range of 770 mV to 970 mV aligns with contemporary power distribution strategies for efficient system design.
• Extended Temperature Grade:  0 °C to 100 °C operating range for deployment in systems that require elevated ambient tolerance compared with commercial-only parts.

Why Choose 1SG250HN3F43E2VG?

The 1SG250HN3F43E2VG positions itself for advanced, compute- and bandwidth-heavy designs by combining very large logic capacity, substantial on-chip RAM, and a high-density I/O package. It draws on Stratix 10 GX family innovations—such as the Intel Hyperflex core architecture and 14 nm FinFET process—delivering a platform suited to implement complex, integrated systems with fewer external components.

This device is ideal for engineers and system architects targeting networking, data center acceleration, and telecom applications that demand scalable logic, large memory resources, and robust I/O. Its extended temperature grade and specified voltage range support reliable operation in a wide range of system environments while leveraging the Stratix 10 family ecosystem and documentation for development and deployment.

Request a quote or submit an inquiry for pricing and availability of 1SG250HN3F43E2VG to move your design from concept to prototype.