1SG250HN3F43E3XG

The 1SG250HN3F43E3XG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-BBGA (FCBGA) package. It delivers a high-capacity, high-bandwidth programmable fabric for advanced applications that require large logic capacity, extensive on-chip memory, and a broad I/O complement.

Built on the Stratix® 10 GX family architecture, this device combines Hyperflex core innovations and 14 nm tri-gate process technologies described for the family to address demanding communications, data center, and high-performance processing applications while operating within a 0 °C to 100 °C range and a core supply of 820 mV to 880 mV.

Key Features

• Core Architecture  Stratix® 10 GX family innovations including the Intel Hyperflex core architecture provide the underlying fabric architecture referenced for this device family.
• Logic Capacity  2,500,000 logic elements enable very large, complex logic implementations and system integration within a single device.
• On‑Chip Memory  204,472,320 total RAM bits provide substantial embedded memory for buffering, packet processing, and large data structures.
• I/O and Package  688 user I/Os and a 1760-BBGA (FCBGA) package (supplier device package: 1760-FBGA, 42.5 × 42.5 mm) support dense external connectivity and system routing.
• Power Supply and Thermal  Core voltage supply range 820 mV to 880 mV and an operating temperature range of 0 °C to 100 °C (Extended grade) for applications matching those environmental limits.
• High‑Speed SerDes and Protocol IP  Stratix® 10 family transceiver technologies support high data-rate links; family-level features include multi-gigabit transceivers and hard IP such as PCI Express Gen3 and advanced Ethernet/FEC capabilities.
• DSP and Compute  Family-level variable-precision DSP blocks are included in the Stratix® 10 GX family architecture to support high-throughput signal processing workloads.
• Configuration and System Reliability  The family documentation describes device configuration, secure device manager features, and partial/dynamic reconfiguration capabilities for flexible system management.

Typical Applications

• Network and Telecom Systems  Multi‑Gbps transceiver capability and 688 I/Os make this device suitable for switch, router, and line-card designs that require dense I/O and high-speed links.
• Data Center Acceleration  Large logic capacity and extensive on-chip memory support hardware acceleration of compute and packet-processing tasks in data center appliances and accelerators.
• High‑Performance Computing and Signal Processing  The combination of millions of logic elements and family DSP resources addresses demanding signal‑processing, encryption, and algorithmic workloads.
• Test, Measurement, and Prototyping  Broad I/O and substantial RAM resources allow integration of complex instrumentation, real-time data capture, and system prototyping within a single FPGA.

Unique Advantages

• Massive Logic Integration: 2,500,000 logic elements reduce the need for multiple devices, simplifying board design and lowering system BOM complexity.
• Large On‑Chip Memory: Over 204 million RAM bits provide substantial local buffering and reduce dependence on external memory for many use cases.
• Extensive I/O in a Compact Package: 688 I/Os in a 1760‑ball FCBGA (42.5 × 42.5 mm) package enable dense external connectivity while conserving PCB area.
• Family‑Level High‑Speed Connectivity: Stratix® 10 GX family transceiver and protocol IP options support implementation of high-bandwidth serial links and common datacom protocols.
• Designed for Complex Systems: Support for device configuration management and dynamic reconfiguration described for the family helps implement flexible, field‑updatable systems.

Why Choose 1SG250HN3F43E3XG?

The 1SG250HN3F43E3XG delivers an FPGA platform built around the Stratix® 10 GX family architecture, combining very large logic capacity, extensive embedded memory, and broad I/O to address high-bandwidth, compute-intensive designs. Its electrical and thermal specifications (820 mV–880 mV core supply; 0 °C–100 °C operating range) and FCBGA footprint make it suitable for systems that require dense integration and high-performance programmable logic.

This part is positioned for designers building advanced networking, data center, and high-performance signal processing systems who need a single-device solution that scales to large designs and leverages the documented features of the Stratix® 10 GX device family.

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