1SG250HN3F43E3VGAS
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2500000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 338 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 312500 | Number of Logic Elements/Cells | 2500000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 204472320 |
Overview of 1SG250HN3F43E3VGAS – Stratix® 10 GX FPGA, 2,500,000 logic elements, 688 I/O, 1760-BBGA
The 1SG250HN3F43E3VGAS is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-BBGA (FCBGA) package designed for high-density, high-bandwidth designs. It delivers 2,500,000 logic elements and a large on-chip RAM complement to support complex logic, buffering, and data-path implementations.
Based on Stratix 10 GX family innovations, this device targets advanced applications requiring significant logic capacity, extensive I/O, and robust memory resources, while benefiting from family-level architecture advances such as the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology.
Key Features
- Logic Capacity 2,500,000 logic elements to support large-scale FPGA designs and complex algorithms.
- On-chip Memory 204,472,320 total RAM bits for deep buffering, lookup tables, and data storage within the fabric.
- I/O Density 688 general-purpose I/O pins to interface with high-channel-count systems and mezzanine connectors.
- Package & Mounting 1760-BBGA (FCBGA) supplier package 1760-FBGA (42.5 × 42.5 mm); surface-mount mounting type for compact board integration.
- Power Supply Range Core voltage supply range from 770 mV to 970 mV to match system power delivery requirements.
- Operating Range & Grade Extended grade with an operating temperature range of 0 °C to 100 °C for use in commercial and extended-temperature environments.
- Environmental Compliance RoHS compliant, meeting common environmental and material requirements.
- Family-level Innovations Built on the Stratix 10 GX family which includes the Intel Hyperflex core architecture, heterogeneous 3D SiP transceiver tiles, high-speed transceiver support, hard PCI Express IP, and advanced DSP and memory subsystems (family-level features described in the Stratix 10 GX/SX device overview).
Typical Applications
- High-performance Networking Large logic capacity and high I/O count enable packet processing, switching, and routing functions in network equipment.
- Data Center Acceleration On-chip RAM and extensive logic resources support custom accelerators and offload engines for data-center workloads.
- High-speed Signal Processing Substantial logic and memory resources are suitable for real-time signal processing, DSP pipelines, and multi-channel data aggregation.
- Telecommunications & Backplane Systems High I/O density and family-level transceiver capabilities address bandwidth and connectivity requirements for telecom line cards and backplane interfaces.
Unique Advantages
- Massive Logic Scale: 2,500,000 logic elements provide the capacity to implement large, consolidated FPGA designs and reduce the need for multiple devices.
- Large On-Chip RAM: Over 204 million bits of embedded RAM support deep buffering and stateful processing directly in the fabric.
- High I/O Count: 688 I/O pins simplify integration with multi-channel front-ends, high-pin mezzanines, and parallel interfaces.
- Robust Packaging: 1760-BBGA FCBGA in a 42.5 × 42.5 mm footprint enables high-density board layouts while supporting surface-mount assembly.
- Controlled Power Window: A defined core voltage range (770 mV–970 mV) helps with predictable power delivery planning during system design.
- Extended Operating Grade: Rated 0 °C to 100 °C for designs that require extended commercial temperature operation.
Why Choose 1SG250HN3F43E3VGAS?
The 1SG250HN3F43E3VGAS positions itself for demanding FPGA applications that require a combination of very high logic density, significant on-chip memory, and extensive I/O. Its Stratix 10 GX family heritage brings architecture-level advancements that support high-throughput, compute-intensive designs while enabling compact, high-density board implementations.
This device is well suited for engineering teams developing networking, data-center acceleration, and high-speed signal-processing products that benefit from scalable logic resources, ample embedded RAM, and a high pin-count package. Choosing this part gives access to the Stratix 10 GX family ecosystem and documentation for implementing large, performance-oriented FPGA systems.
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