1SG250HN3F43E3VGAS

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2500000 1760-BBGA, FCBGA

Quantity 338 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs312500Number of Logic Elements/Cells2500000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits204472320

Overview of 1SG250HN3F43E3VGAS – Stratix® 10 GX FPGA, 2,500,000 logic elements, 688 I/O, 1760-BBGA

The 1SG250HN3F43E3VGAS is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-BBGA (FCBGA) package designed for high-density, high-bandwidth designs. It delivers 2,500,000 logic elements and a large on-chip RAM complement to support complex logic, buffering, and data-path implementations.

Based on Stratix 10 GX family innovations, this device targets advanced applications requiring significant logic capacity, extensive I/O, and robust memory resources, while benefiting from family-level architecture advances such as the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology.

Key Features

  • Logic Capacity  2,500,000 logic elements to support large-scale FPGA designs and complex algorithms.
  • On-chip Memory  204,472,320 total RAM bits for deep buffering, lookup tables, and data storage within the fabric.
  • I/O Density  688 general-purpose I/O pins to interface with high-channel-count systems and mezzanine connectors.
  • Package & Mounting  1760-BBGA (FCBGA) supplier package 1760-FBGA (42.5 × 42.5 mm); surface-mount mounting type for compact board integration.
  • Power Supply Range  Core voltage supply range from 770 mV to 970 mV to match system power delivery requirements.
  • Operating Range & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for use in commercial and extended-temperature environments.
  • Environmental Compliance  RoHS compliant, meeting common environmental and material requirements.
  • Family-level Innovations  Built on the Stratix 10 GX family which includes the Intel Hyperflex core architecture, heterogeneous 3D SiP transceiver tiles, high-speed transceiver support, hard PCI Express IP, and advanced DSP and memory subsystems (family-level features described in the Stratix 10 GX/SX device overview).

Typical Applications

  • High-performance Networking  Large logic capacity and high I/O count enable packet processing, switching, and routing functions in network equipment.
  • Data Center Acceleration  On-chip RAM and extensive logic resources support custom accelerators and offload engines for data-center workloads.
  • High-speed Signal Processing  Substantial logic and memory resources are suitable for real-time signal processing, DSP pipelines, and multi-channel data aggregation.
  • Telecommunications & Backplane Systems  High I/O density and family-level transceiver capabilities address bandwidth and connectivity requirements for telecom line cards and backplane interfaces.

Unique Advantages

  • Massive Logic Scale: 2,500,000 logic elements provide the capacity to implement large, consolidated FPGA designs and reduce the need for multiple devices.
  • Large On-Chip RAM: Over 204 million bits of embedded RAM support deep buffering and stateful processing directly in the fabric.
  • High I/O Count: 688 I/O pins simplify integration with multi-channel front-ends, high-pin mezzanines, and parallel interfaces.
  • Robust Packaging: 1760-BBGA FCBGA in a 42.5 × 42.5 mm footprint enables high-density board layouts while supporting surface-mount assembly.
  • Controlled Power Window: A defined core voltage range (770 mV–970 mV) helps with predictable power delivery planning during system design.
  • Extended Operating Grade: Rated 0 °C to 100 °C for designs that require extended commercial temperature operation.

Why Choose 1SG250HN3F43E3VGAS?

The 1SG250HN3F43E3VGAS positions itself for demanding FPGA applications that require a combination of very high logic density, significant on-chip memory, and extensive I/O. Its Stratix 10 GX family heritage brings architecture-level advancements that support high-throughput, compute-intensive designs while enabling compact, high-density board implementations.

This device is well suited for engineering teams developing networking, data-center acceleration, and high-speed signal-processing products that benefit from scalable logic resources, ample embedded RAM, and a high pin-count package. Choosing this part gives access to the Stratix 10 GX family ecosystem and documentation for implementing large, performance-oriented FPGA systems.

Request a quote or submit an inquiry to evaluate part 1SG250HN3F43E3VGAS for your design requirements; include the part number and any quantity or delivery details so pricing and availability can be provided.

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