1SG250HN3F43E2LG

The 1SG250HN3F43E2LG is an Intel Stratix® 10 GX field programmable gate array in a 1760-ball FCBGA package. It combines a high-density logic fabric with large on-chip memory and a wide I/O complement to address demanding bandwidth and processing applications.

Built on Stratix 10 family architecture, this device targets high-performance networking, compute acceleration and advanced signal-processing systems where large logic capacity, substantial RAM and flexible I/O are required, while supporting an extended operating grade for trusted operation across 0°C to 100°C.

Key Features

• Logic Capacity  Provides 2,500,000 logic elements suitable for complex, high-density implementations and large FPGA designs.
• On‑Chip Memory  Includes 204,472,320 total RAM bits to support deep buffering, packet processing and large FPGA-resident data structures.
• I/O Density  688 I/O pins enable extensive external interface connectivity for multi-channel PHYs, memory interfaces and board-level peripherals.
• Package & Mounting  1760-BBGA FCBGA (1760-FBGA, 42.5 × 42.5 mm) package; surface-mount for standard PCB assembly.
• Power and Operating Range  Core supply range 820 mV to 880 mV and an operating temperature range of 0°C to 100°C (Extended grade) to match system power and thermal requirements.
• Family-Level Architecture  Part of the Stratix 10 GX family featuring the Intel Hyperflex core architecture and Intel 14 nm tri‑gate process (family-level attributes described in the device overview).
• Regulatory  RoHS compliant.

Typical Applications

• Data Center Networking  High logic density and large on-chip RAM enable complex packet processing, routing and switching functions with abundant I/O for multi-lane transceiver interfaces.
• Compute Acceleration  Large logic element count and substantial RAM support custom acceleration engines and offload functions for high-throughput workloads.
• Telecommunications Infrastructure  Extensive I/O and family-level high-speed transceiver capability make this device suitable for backplane and line-card designs in telecom systems.
• Advanced Signal Processing  Significant on-chip memory and logic resources support real-time DSP chains, channel aggregation and complex algorithm implementations.

Unique Advantages

• High-density programmable fabric: 2,500,000 logic elements provide headroom for large designs and multi-function integration on a single device.
• Large on-chip memory: Over 204 million bits of RAM reduce dependence on external memory for buffering and state storage, simplifying board-level design.
• Extensive I/O capability: 688 I/O pins give designers flexibility for parallel interfaces, multiple memory channels or wide peripheral connectivity.
• Industry-standard package: 1760-FBGA (42.5 × 42.5 mm) enables compact board integration while supporting high pin-count routing.
• Extended operating grade: Rated 0°C to 100°C to meet systems requiring extended-temperature operation without resorting to industrial-grade classification.
• RoHS compliant: Conforms to RoHS requirements for regulatory and environmental compatibility.

Why Choose 1SG250HN3F43E2LG?

The 1SG250HN3F43E2LG is positioned for designs that require substantial programmable logic, large embedded memory and broad I/O connectivity in a single Stratix 10 GX device. Its combination of 2.5 million logic elements, 204,472,320 RAM bits and 688 I/Os supports integration of complex algorithms, large buffering and multi-channel interfaces without partitioning across multiple FPGAs.

Engineers building high-performance networking, compute acceleration or advanced signal-processing systems will find this device offers scalable capacity and family-level architectural benefits described in the Stratix 10 documentation. Its extended operating range and standard FCBGA package make it suitable for production-grade board designs where reliability and density are priorities.

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