1SG250HN2F43I2VG

The 1SG250HN2F43I2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-BBGA FCBGA package. It delivers large fabric capacity and high I/O density for advanced applications that require significant programmable logic, large on-chip memory, and robust I/O connectivity.

Built on the Stratix 10 family architecture, this device targets high-bandwidth processing and complex system integration where performance, integration, and thermal tolerance across industrial temperature ranges are required.

Key Features

• Logic Capacity 2,500,000 logic elements provide extensive programmable fabric for large, complex designs.
• Memory Resources 204,472,320 total RAM bits for deep on-chip storage of buffers, look-up tables, and state.
• I/O Density 688 user I/Os to support high-pin-count interfaces and parallel connectivity.
• Package and Mounting 1760-BBGA (FCBGA) package, supplier device package 1760-FBGA (42.5 × 42.5 mm); surface-mount device.
• Voltage Range Core supply range of 770 mV to 970 mV to match platform power designs.
• Operating Temperature Industrial-grade operation from −40 °C to 100 °C for use in temperature-challenging environments.
• Family Innovations (Series-Level) Stratix 10 family innovations include the Intel Hyperflex core architecture, Intel 14 nm tri-gate (FinFET) process, heterogeneous 3D SiP transceiver tiles, and high-speed transceiver capabilities up to 28.3 Gbps (as described in the Stratix 10 GX/SX device overview).
• Hard IP and Transceivers (Series-Level) Series-level features include hard PCI Express Gen3 x16 IP and hard 10G Ethernet / forward error correction in transceiver channels (as described in the device overview).
• RoHS Compliance Device is RoHS compliant.

Typical Applications

• High‑bandwidth Networking and Telecom Large logic capacity and high I/O count enable packet processing, switching fabrics, and protocol offload implementations.
• Data Center and Compute Acceleration Substantial on-chip RAM and logic resources support compute offload, buffering, and custom accelerator functions.
• High‑Performance Signal Processing Large memory and logic resources permit complex DSP pipelines and real-time data handling.
• System Integration and Prototyping Dense I/O and advanced family-level IP features make the device suitable for complex system validation and integration tasks.

Unique Advantages

• Extensive Fabric Capacity: 2.5 million logic elements enable implementation of large, multi-function systems in a single FPGA.
• Massive On‑Chip Memory: Over 204 million bits of RAM reduce dependence on external memory for buffering and state retention.
• High I/O Count: 688 I/Os simplify routing of parallel interfaces and large connector-based designs without external multiplexing.
• Industrial Temperature Range: −40 °C to 100 °C operation supports deployment in temperature-challenging environments.
• Compact, High‑Density Package: 1760-BBGA FCBGA format provides high pin count in a 42.5 × 42.5 mm footprint for space-constrained boards.
• Series Innovation Backing: The device is part of the Stratix 10 family, which includes Hyperflex architecture and high-speed transceiver technologies for demanding bandwidth and processing needs.

Why Choose 1SG250HN2F43I2VG?

The 1SG250HN2F43I2VG positions itself for designs that require very large programmable logic capacity, significant on-chip memory, and high I/O connectivity within an industrial temperature envelope. It brings together the Stratix 10 family’s architectural advances and high-speed I/O density in a high-pin-count FCBGA package to enable complex, integrated systems.

This part is suited to engineering teams developing high-bandwidth networking, compute acceleration, and advanced signal-processing applications that demand scalable logic, ample memory, and robust I/O. Selecting this device supports long-term design scalability while leveraging the Stratix 10 family’s documented innovations.

Request a quote or submit an inquiry for 1SG250HN2F43I2VG to obtain pricing, availability, and lead-time information for your design program.