1SG250HN2F43I1VG

The 1SG250HN2F43I1VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) supplied in a 1760-BBGA FCBGA package. Built on the Stratix 10 GX family architecture, the device is designed for advanced applications that require high logic density, large embedded memory, and extensive I/O connectivity.

With the Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) technology detailed in the Stratix 10 GX family documentation, this FPGA targets demanding designs where bandwidth, processing performance, and integration density are critical.

Key Features

• Logic Capacity — 2,500,000 logic elements provide high-density programmable fabric for complex designs and large-scale integration.
• Embedded Memory — 204,472,320 total RAM bits for on-chip buffering, data staging, and large state storage.
• I/O and Connectivity — 688 user I/O pins to support extensive external interfaces and high-channel-count systems.
• Core Architecture — Built on the Intel Hyperflex core architecture from the Stratix 10 GX family, offering the family-level performance and efficiency innovations described in the device overview.
• Process Technology — Family-level design leverages 14 nm tri-gate (FinFET) technology as described in the Stratix 10 GX documentation.
• Package and Mounting — 1760-BBGA, FCBGA package (1760-FBGA, 42.5 × 42.5 mm) optimized for high-density PCB integration; surface mount type.
• Power — Core supply range 770 mV to 970 mV to support efficient core operation.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for industrial environments.
• Standards and Compliance — RoHS compliant.

Typical Applications

• High‑performance Networking — Use the device’s dense logic and large embedded RAM for packet processing, switching fabrics, and high-bandwidth communication endpoints.
• Data Center and Accelerators — Implement hardware acceleration, offload engines, and custom compute pipelines that benefit from high logic density and on-chip memory.
• Telecom and Backplane Interfaces — Leverage extensive I/O and family-level transceiver capabilities for backplane, optical, and high-speed serial links.
• Advanced Signal Processing — Deploy DSP and memory resources for real-time processing pipelines, filtering, and transform algorithms.

Unique Advantages

• High Logic Density: 2.5 million logic elements enable integration of complex systems and consolidation of multiple functions into a single FPGA.
• Large On‑Chip Memory: Over 204 million bits of embedded RAM reduce external memory dependency and improve processing latency.
• Extensive I/O Count: 688 I/O pins support multi-channel interfaces and high-pin-count connectivity without additional bridge components.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in demanding industrial environments.
• Compact High‑Density Package: 1760-FBGA (42.5 × 42.5 mm) package provides a dense footprint for board-level integration while supporting large FPGA resources.
• Family‑Level Innovations: Incorporates Stratix 10 GX family technologies such as the Intel Hyperflex core architecture and 14 nm tri-gate FinFET process for improved performance and power efficiency.

Why Choose 1SG250HN2F43I1VG?

The 1SG250HN2F43I1VG positions itself as a high-density, industrial-grade Stratix 10 GX FPGA suited for applications that demand substantial logic resources, abundant on-chip RAM, and significant I/O capacity. It is appropriate for designers consolidating complex functions into a single programmable device while maintaining industrial temperature operation.

As part of the Stratix 10 GX family, this device benefits from the family-level architecture and process technologies described in the device documentation, offering a pathway for scalable, high-performance system designs backed by documented device-level capabilities.

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