1SG250HN1F43I2LG

The Intel Stratix® 10 GX field programmable gate array (FPGA) 1SG250HN1F43I2LG is a high-density, industrial-grade FPGA in a 1760-BBGA (FCBGA) package. It delivers 2,500,000 logic elements and 204,472,320 total RAM bits, targeting designs that require very high logic capacity, large on-chip memory, and substantial I/O.

Built on the Stratix® 10 GX family architecture, the device leverages the family’s Hyperflex core innovations and high-speed transceiver capabilities to address bandwidth- and compute-intensive applications in networking, communications, and advanced signal processing.

Key Features

• Core Architecture  Intel Stratix 10 Hyperflex core architecture (family) designed to increase core performance relative to prior-generation high-performance FPGAs.
• Logic Capacity  2,500,000 logic elements (cells) to implement large-scale programmable logic and complex system-level functions.
• On‑Chip Memory  204,472,320 total RAM bits of embedded memory for buffering, frame storage, and intermediate processing.
• I/O and High‑Speed Connectivity  688 user I/O pins for broad external interfacing; Stratix 10 family transceiver technology supports very high data rates for demanding link requirements.
• Package and Mounting  1760-BBGA (FCBGA) package, supplier device package 1760-FBGA (42.5 × 42.5 mm); surface-mount device suitable for dense board layouts.
• Supply Voltage  Core voltage range 820 mV to 880 mV, enabling precise power planning for core power domains.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial-environment applications.
• Regulatory Status  RoHS compliant.

Typical Applications

• High‑Performance Networking  Implement packet processing, switching, and custom forwarding engines using the device’s large logic capacity and extensive I/O.
• Telecommunications Systems  Support line cards, backplane interfaces, and protocol processing where high bandwidth and large on-chip memory are required.
• Data Center Acceleration  Offload compute-intensive workloads and implement hardware accelerators that leverage substantial logic and memory resources.
• Advanced Signal Processing  Deploy large-scale DSP pipelines and buffering for applications that need wide parallelism and deep on-chip RAM.

Unique Advantages

• High Logic Density: 2.5 million logic elements enable consolidation of large systems into a single device, reducing board count and interconnect complexity.
• Large On‑Chip Memory: Over 204 million RAM bits provide ample space for frame buffering, lookup tables, and state storage, improving processing throughput.
• Robust Industrial Ratings: Industrial temperature range (−40 °C to 100 °C) and surface-mount packaging support deployment in demanding environments.
• Broad I/O Reach: 688 I/O pins allow flexible interfacing to high-pin-count subsystems and multiple external memories or peripherals.
• Compact, High‑Density Package: 1760-BBGA FCBGA package balances high pin count with a compact 42.5 × 42.5 mm footprint for dense PCB layouts.

Why Choose 1SG250HN1F43I2LG?

This Stratix® 10 GX FPGA is positioned for designs that demand very high programmable logic capacity and substantial embedded memory while maintaining industrial operating range and a high I/O count. Its Hyperflex-family architecture and Stratix 10 family connectivity features make it suitable for bandwidth- and compute-intensive applications such as networking, telecommunications, data center acceleration, and advanced signal processing.

For teams designing large-scale FPGA systems, the 1SG250HN1F43I2LG offers a compact, high-density package and measurable electrical characteristics (core voltage 820–880 mV) that support precise power and thermal planning, delivering long-term scalability and integration within Stratix 10–based designs.

Request a quote or submit an inquiry to get pricing, lead time, and availability for 1SG250HN1F43I2LG. Our team will provide the information needed to move your design forward.