1SG250HN1F43E1VG

The 1SG250HN1F43E1VG is a Stratix® 10 GX field-programmable gate array (FPGA) in a 1760-BBGA (FCBGA) package. It provides 2,500,000 logic elements, 204,472,320 total RAM bits and 688 I/O pins, delivering dense programmable logic and on-chip memory for high-performance, bandwidth-focused designs.

Built on the Stratix 10 GX family architecture, this device targets high-performance applications that require significant logic capacity, large embedded memory, and extensive I/O connectivity while operating within an extended-grade temperature range and a low core voltage supply window.

Key Features

• Core Logic and Architecture 2,500,000 logic elements for complex programmable logic integration; based on Stratix 10 GX family architecture innovations described in the device overview.
• On-chip Memory 204,472,320 total RAM bits of embedded memory to support large buffering, packet processing, or on-chip data storage.
• I/O Capacity 688 available I/O pins in a high-density 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm supplier package) footprint for extensive external connectivity.
• Package and Mounting 1760-BBGA (FCBGA) surface-mount package suitable for high-density board designs.
• Power Supply Core voltage supply range of 770 mV to 970 mV to align with low-voltage FPGA core domains.
• Temperature and Grade Extended grade device with an operating temperature range of 0°C to 100°C suitable for demanding commercial and enterprise environments.
• Standards and Compliance RoHS compliant.
• Stratix 10 Family Innovations (series level) Family-level features documented for Stratix 10 GX devices include Intel Hyperflex core architecture, 14 nm tri-gate process, advanced transceiver and DSP capabilities, and hard IP blocks for high-speed I/O and memory interfaces.

Typical Applications

• High-speed networking and switch fabrics — Use large logic capacity, extensive I/O and family transceiver capabilities to implement packet processing, forwarding engines, and protocol offload.
• Data center acceleration and compute — Large on-chip RAM and massive logic resources support custom acceleration workloads and inline data processing.
• High-performance communications — The device’s I/O density and family transceiver features suit line cards, backplane interfaces, and multi-protocol communications hardware.

Unique Advantages

• Massive logic density: 2,500,000 logic elements enable integration of large, complex designs that reduce external component count.
• Large embedded memory: 204,472,320 total RAM bits support extensive buffering and on-chip data storage for latency-sensitive processing.
• High I/O count in a compact package: 688 I/Os in a 1760-BBGA (42.5 × 42.5 mm) footprint provides broad connectivity without increasing PCB area significantly.
• Low-voltage core operation: 770 mV–970 mV supply range aligns with modern low-voltage system power domains for efficient integration.
• Extended-grade reliability: Specified for 0°C to 100°C operation to meet demanding commercial and enterprise thermal environments.
• RoHS compliance: Meets environmental material requirements for global product deployment.

Why Choose 1SG250HN1F43E1VG?

The 1SG250HN1F43E1VG combines very large programmable logic, substantial on-chip memory and high I/O density in a single extended-grade Stratix 10 GX FPGA package. It is positioned for designs that require significant compute and buffering capability, broad external connectivity, and integration within low-voltage system architectures.

This device is well suited to engineers developing high-throughput networking, communications and compute-acceleration hardware who need scalable logic resources, large embedded RAM, and a proven family architecture. The combination of specifications simplifies system design by consolidating functionality into one high-density FPGA platform backed by Stratix 10 family documentation and tooling.

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