1SG250HH3F55I3VG

The 1SG250HH3F55I3VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) offered in a 2912-BBGA (FCBGA 55×55) package and specified for industrial operation. It delivers a large programmable fabric—2,500,000 logic elements—together with extensive on-chip memory and high I/O density for demanding, high-performance applications.

Built on the Stratix 10 family architecture, this device leverages the Hyperflex core innovations described for the family and is intended for use where high logic capacity, substantial embedded RAM, and significant I/O count are required, all within an industrial temperature range and low-voltage core supply window.

Key Features

• Core Architecture  Based on the Intel Stratix 10 GX family architecture and Intel Hyperflex core innovations referenced in the device family documentation.
• Logic Capacity  2,500,000 logic elements provide large-scale programmable logic resources for complex designs.
• On-chip Memory  204,472,320 total RAM bits deliver substantial embedded memory for buffering, packet processing, and large state machines.
• I/O and Connectivity  1,160 I/O pins support high-density external interfacing and system integration.
• Power Supply  Core voltage supply range of 770 mV to 970 mV to match low-voltage FPGA core power domains.
• Thermal and Environmental  Industrial operating temperature range from −40 °C to 100 °C and RoHS compliance for regulated environments.
• Package and Mounting  2912-BBGA (FCBGA 55×55) surface-mount package for compact board-level integration.
• Family-Level IO/Transceiver Capabilities  Stratix 10 GX family documentation highlights advanced transceiver and high-speed interface support (family-level features referenced in device documentation).

Typical Applications

• High-performance Networking  Large logic capacity and abundant I/O make this device suitable for packet processing, switching, and network function implementations.
• Data Center Acceleration  Substantial embedded RAM and logic resources support acceleration tasks such as custom offloads and protocol processing.
• Telecommunications Infrastructure  Designed for systems that require high-density I/O and the family-level transceiver capabilities referenced in the device documentation.
• Compute and DSP-heavy Workloads  The device’s logic and memory resources support complex signal processing and algorithmic implementations.

Unique Advantages

• High Logic Density: 2,500,000 logic elements enable large-scale integration of custom logic and accelerators on a single device.
• Large Embedded Memory: Over 204 million bits of on-chip RAM reduce reliance on external memory for many buffering and state storage tasks.
• Extensive I/O Count: 1,160 I/O pins simplify system-level interfacing and support complex board connectivity.
• Industrial Temperature Range: Specified operation from −40 °C to 100 °C supports deployment in industrial environments.
• Compact High-pin Package: 2912-BBGA (FCBGA 55×55) provides a high-pin-count solution in a compact footprint for dense board designs.
• Low-voltage Core Support: Core supply range of 770–970 mV aligns with modern low-voltage FPGA power domains.

Why Choose 1SG250HH3F55I3VG?

The 1SG250HH3F55I3VG combines very high logic capacity, large on-chip memory, and a high I/O count in an industrial-temperature, RoHS-compliant FCBGA package. It is positioned for system designs that require substantial programmable resources and dense external interfacing while operating within a low-voltage core supply window.

This device is appropriate for engineering teams building advanced networking, telecommunications, data-center acceleration, and DSP-focused systems who need a scalable FPGA fabric backed by the Stratix 10 family architecture documented by the manufacturer.

Request a quote or submit an inquiry today to discuss availability, pricing, and how this Stratix® 10 GX FPGA can meet your design requirements.