1SG250HH3F55I1VG

The 1SG250HH3F55I1VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) packaged in a 2912-ball BGA (FCBGA) and rated for industrial operation. This device combines very high logic density with large on‑chip RAM and extensive I/O to address demanding, high-performance digital designs.

Built on the Stratix 10 family architecture, the device benefits from the series’ advanced core innovations and high-speed interface capabilities to support applications that require dense logic, substantial memory bandwidth, and robust I/O connectivity.

Key Features

• Logic Capacity  Provides 2,500,000 logic elements for implementing large-scale digital designs and complex system functions.
• On‑Chip Memory  Total of 204,472,320 bits of embedded RAM to support buffering, packet processing, and large state machines without immediate external memory dependence.
• I/O Density  1160 device I/O pins available to support wide parallel interfaces and numerous high-speed links.
• Advanced Series Architecture  Leverages Intel Stratix 10 family innovations such as the Intel Hyperflex core architecture and 14 nm tri‑gate (FinFET) process as described for the series.
• High‑Speed Serial and Protocol Support (Series)  Stratix 10 GX series features include high-performance transceivers and hard IP for protocols such as PCI Express Gen1/Gen2/Gen3 and high-speed Ethernet (as documented for the device family).
• Package & Mounting  2912‑BBGA (FCBGA) package, supplier package noted as 2912‑FBGA, FC (55×55), and surface-mount construction for standard PCB assembly.
• Power and Temperature  Core supply range 770 mV to 970 mV and industrial operating temperature from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance  RoHS compliant per supplier declaration.

Typical Applications

• Telecom and Networking  High-density logic and extensive I/O make the device suitable for line cards, protocol processing, and high-speed packet processing.
• Data Center Acceleration  Large on-chip RAM and high logic capacity support compute acceleration, flow processing, and custom offload engines.
• High-Speed Test & Measurement  Wide I/O and series transceiver capabilities enable instrumentation and high-bandwidth data capture systems.
• Broadcast and Video Processing  Significant DSP and memory resources in the Stratix 10 family support multi-channel video pipelines and format conversion tasks (as applicable to the series).

Unique Advantages

• High Logic Density: 2,500,000 logic elements enable consolidation of complex subsystems into a single device, reducing board-level component count.
• Large Embedded Memory: Over 204 million bits of on-chip RAM reduce reliance on external memory for many buffering and stateful functions, improving latency and simplifying board design.
• Broad I/O Resource: 1160 I/O pins provide flexibility to connect multiple peripherals, wide buses, and parallel interfaces without extensive multiplexing.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in temperature-challenging commercial and industrial environments.
• Optimized Power Envelope: Core supply between 770 mV and 970 mV aligns with low-voltage system designs while supporting the device’s performance needs.
• Proven Series Technologies: Integration in the Stratix 10 family brings architectural advancements and documented high-speed IP options available across the series.

Why Choose 1SG250HH3F55I1VG?

The 1SG250HH3F55I1VG targets engineers and system architects who need a high-capacity, industrial‑rated FPGA with large on‑chip memory and abundant I/O. Its placement in the Stratix 10 GX family means designers can take advantage of the family’s core architecture and high-speed interface capabilities while addressing large-scale logic and memory requirements.

This device is well suited to designs where consolidating functions into a single, high-density FPGA reduces board complexity and lowers system-level BOM. The industrial temperature rating, RoHS compliance, and standard FCBGA package make it a practical choice for production deployments requiring robust environmental margins.

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