1SG250HH3F55E3VG

The 1SG250HH3F55E3VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) supplied in a 2912‑BBGA surface‑mount package. It integrates a high logic capacity and substantial on‑chip memory with a large I/O count to support bandwidth‑intensive and compute‑heavy designs.

Built on the Stratix® 10 family architecture, this device leverages the Intel Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) process innovations to deliver the performance and efficiency required for advanced networking, data transport, and hardware acceleration applications.

Key Features

• Logic Capacity — 2,500,000 logic elements provide a large programmable fabric for high‑density logic and complex designs.
• On‑chip Memory — 204,472,320 total RAM bits of embedded memory to support large buffers, packet processing, and data‑intensive algorithms.
• I/O and Connectivity — 1,160 I/O pins to accommodate extensive external interfaces and high‑bandwidth connectivity requirements.
• Package and Mounting — 2912‑BBGA (FCBGA) package, supplier package listed as 2912‑FBGA, FC (55×55); surface mount for compact board designs.
• Power Supply Range — Core voltage supply range of 770 mV to 970 mV for core power provisioning and system power design.
• Operating Range & Grade — Extended grade device rated for 0 °C to 100 °C operating temperature.
• Family Innovations — Based on Intel Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) technology as documented for the Stratix 10 family.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High‑performance Networking — Large logic and memory resources plus high I/O count suit packet processing, switch/router functions, and protocol offload.
• Data Center Acceleration — Dense programmable fabric and substantial on‑chip RAM support hardware acceleration and custom compute engines.
• Telecommunications & Backplane Systems — Designed to meet bandwidth and processing needs in telecom line cards and backplane interfaces.
• Test, Measurement & Instrumentation — High logic capacity and I/O flexibility enable complex signal processing and multi‑channel data acquisition designs.

Unique Advantages

• High Logic Density: 2,500,000 logic elements enable large, integrated designs and reduced need for multi‑chip solutions.
• Substantial On‑Chip Memory: Over 204 million RAM bits for large buffering, lookup tables, and embedded data storage.
• Extensive I/O: 1,160 I/O pins provide flexibility for multi‑lane interfaces and numerous peripheral connections.
• Advanced Process and Architecture: Leverages Hyperflex core architecture and 14 nm tri‑gate (FinFET) technology as part of the Stratix 10 family innovations for improved performance and efficiency.
• System‑Ready Package: 2912‑BBGA, surface‑mount package supports compact, high‑density board layouts.
• Extended Operating Grade: Rated 0 °C to 100 °C to match a wide range of commercial and extended‑temperature system environments.

Why Choose 1SG250HH3F55E3VG?

The 1SG250HH3F55E3VG combines a very large logic fabric, extensive embedded memory, and a high I/O count in a compact 2912‑BBGA package, making it suitable for designs that demand high bandwidth and significant on‑device processing. As a member of the Intel Stratix 10 family, it incorporates documented architectural innovations such as the Hyperflex core and 14 nm FinFET process improvements to address performance and power objectives.

This device is well suited to engineers and system designers implementing advanced networking, acceleration, and data‑plane functions who require scalable logic capacity and abundant memory and I/O resources. Its extended grade rating and RoHS compliance help integrate the part into a broad set of commercial and extended‑temperature applications while aligning with established Intel Stratix 10 documentation and device family support.

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