1SG250HH3F55I2LG

The 1SG250HH3F55I2LG is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) supplied in a 2912-ball FCBGA package. It combines a high-density programmable fabric—2,500,000 logic elements—with large on-chip RAM and a high I/O count to address demanding, bandwidth- and compute-intensive system designs.

Designed for industrial-temperature operation, this device targets applications that require dense logic, large memory resources, high-speed serial connectivity and platform-level integration, delivering a balance of performance, integration and system-level flexibility.

Key Features

• High-density logic — 2,500,000 logic elements to implement large-scale custom logic, complex algorithms and packet processing functions.
• Extensive on-chip memory — 204,472,320 total RAM bits for buffering, packet queues, lookup tables and embedded data storage.
• Large I/O capacity — 1,160 I/O pins to support dense board-level interfacing, multiple high-speed lanes and broad peripheral connectivity.
• Advanced core architecture — Intel Hyperflex core architecture (Stratix 10 family) delivering notable core performance improvements over prior-generation high-performance FPGAs.
• High-speed serial capability — Family-level heterogeneous 3D SiP transceiver tiles and transceiver PMA/PCS features designed for high-bandwidth chip-to-chip, module and backplane links (family documentation cites up to 28.3 Gbps data rates and support for many transceiver channels).
• DSP and compute resources — Variable-precision DSP blocks and hard IP options in the Stratix 10 family to accelerate signal processing workloads (family overview documents describe substantial TFLOP-class capability and DSP efficiencies).
• Hard IP and system interfaces — Family documentation includes hard PCI Express Gen3 IP, hard 10G/40G Ethernet FEC and hardened memory controller/PHY support for high-speed external memories.
• Package and mounting — 2912-BBGA FCBGA package (supplier device package: 2912-FBGA, FC 55×55) for surface-mount assembly on standard PCBs.
• Power and thermal — Device supply range 820 mV to 880 mV and industrial operating temperature range −40 °C to 100 °C suitable for temperature-tolerant system deployments.
• Environmental compliance — RoHS compliant.

Typical Applications

• High-bandwidth networking and telecom — Implement packet processing, switching and line-rate protocol engines using the device's large logic capacity, on-chip RAM and high-speed serial transceivers.
• Data center acceleration — Offload compute- and I/O-intensive workloads with dense logic, DSP resources and hard PCIe/ethernet IP to support network and storage acceleration functions.
• Advanced test, measurement and instrumentation — Build custom signal processing pipelines and high-channel-count capture systems leveraging the large memory and DSP blocks.
• Embedded compute platforms — Integrate programmable fabric and high I/O density for control plane acceleration, hardware virtualization and platform-level integration in industrial systems.

Unique Advantages

• Massive programmable capacity: 2,500,000 logic elements enable complex SOC-style hardware implementations without external ASICs.
• Substantial on-chip memory: 204,472,320 total RAM bits reduce dependence on external buffering for many high-throughput designs.
• High I/O density: 1,160 I/O pins let you route multiple high-speed interfaces and parallel buses directly to the FPGA.
• Family-level performance innovations: Hyperflex architecture and Stratix 10 family transceiver/IP features provide a foundation for higher core performance and high-speed serial connectivity.
• Industrial operating range: Rated for −40 °C to 100 °C, suitable for deployment in temperature-demanding industrial environments.
• RoHS compliant: Meets lead-free manufacturing requirements for modern production flows.

Why Choose 1SG250HH3F55I2LG?

The 1SG250HH3F55I2LG brings Stratix 10 GX family capabilities into a high-density FPGA package, combining millions of logic elements, hundreds of megabits of embedded RAM and broad I/O to address demanding compute and connectivity tasks. Its industrial temperature rating and surface-mount FCBGA package support robust system integration in commercial and industrial platforms.

This device is suited for teams building high-throughput networking, data-center acceleration, advanced instrumentation or platform-level embedded compute solutions that require scalable programmable logic, on-chip memory and extensive I/O in a single FPGA device.

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