1SG250HH3F55I2VG

The 1SG250HH3F55I2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) IC designed for high-performance, industrial-grade applications. Built on the Stratix 10 family architecture, the device combines the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) process innovations to address demanding bandwidth and processing requirements.

With 2,500,000 logic elements, 204,472,320 total RAM bits and 1,160 user I/Os in a 2912-BBGA FCBGA package, this FPGA is targeted at systems that require large programmable fabric, substantial on-chip memory and high I/O density while operating across an industrial temperature range.

Key Features

• Core Architecture  Intel Hyperflex™ core architecture on 14 nm tri-gate (FinFET) technology, delivering the family-level performance improvements documented for Stratix 10 GX devices.
• Logic Capacity  2,500,000 logic elements for complex custom logic, large-scale state machines and wide datapath implementations.
• On‑Chip Memory  204,472,320 total RAM bits with family support for internal M20K SRAM memory blocks to implement large buffers, FIFOs and on-chip storage.
• High‑Density I/O  1,160 I/O pins to support broad external connectivity and high channel counts in dense system designs.
• Transceivers & Interface IP (Family)  Stratix 10 GX family includes high-speed transceiver and hard IP options such as PCIe Gen3 and 10G Ethernet FEC, enabling high-bandwidth chip-to-chip and backplane interfaces (family-level capabilities).
• Package & Mounting  Surface-mount 2912-BBGA (supplier device package: 2912-FBGA, FC 55×55) for high pin-count board designs.
• Power  Core supply range 770 mV to 970 mV, enabling integration into tightly managed power budgets.
• Environmental & Thermal  Industrial grade device with an operating temperature range of −40 °C to 100 °C and RoHS compliance for environmental conformity.
• Security & Reliability (Family)  Family-level features include secure device management, error detection/correction and support for partial/dynamic reconfiguration to help maintain system reliability.

Typical Applications

• High‑Performance Networking  Use the large logic capacity and high I/O density for packet processing, switch/router line cards and backplane interface logic.
• Data Center Acceleration  Implement custom acceleration, protocol offload and high-bandwidth interconnect logic leveraging extensive on-chip memory and family transceiver options.
• Telecom & Optical Transport  Support for high-speed transceivers and forward error correction at the family level makes this device suitable for transport and aggregation equipment.
• Industrial Systems  Industrial-grade temperature range and robust I/O count enable deployment in demanding control, instrumentation and processing systems.

Unique Advantages

• Massive Logic Density:  2,500,000 logic elements provide headroom for large, complex FPGA designs without partitioning into multiple devices.
• Large On‑Chip Memory:  Over 204 million RAM bits let you implement deep buffers, large lookup tables and memory-centric algorithms on-chip to reduce external memory dependence.
• High I/O Count:  1,160 I/Os simplify board-level routing for multi-channel systems and dense interface requirements.
• Industrial Temperature Range:  Rated from −40 °C to 100 °C for deployment in industrial environments where extended thermal tolerance is required.
• Advanced Family-Level IP:  Stratix 10 GX family features such as Hyperflex architecture, high-speed transceiver support and hard PCIe/ethernet IP provide a platform for high-performance system designs.
• Designed for Complex Systems:  Surface-mount 2912-BBGA packaging supports high pin-count, space-efficient board designs.

Why Choose 1SG250HH3F55I2VG?

The 1SG250HH3F55I2VG delivers a combination of very high logic capacity, substantial on-chip memory and a large I/O complement in an industrial-grade Stratix 10 GX device. It is suited for engineers developing high-bandwidth networking equipment, data center accelerators, telecom infrastructure and industrial processing systems that require a robust, high-performance programmable fabric.

Backed by Stratix 10 family architectural advances and device-level specifications such as core voltage range, package details and operating temperature, this FPGA offers a scalable platform for advanced designs that need significant on-chip resources and proven family-level interface IP.

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