1SG250HH3F55I3XG

The 1SG250HH3F55I3XG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 2912-BBGA FCBGA package designed for industrial applications that require large logic capacity and high I/O density. Built on the Stratix 10 family architecture, the device leverages the family’s Hyperflex core innovations and Intel 14 nm tri-gate technology to address high-bandwidth processing and system integration needs.

Key Features

• Logic Capacity  2,500,000 logic elements suitable for large-scale logic integration and complex FPGA-based implementations.
• Embedded Memory  204,472,320 total RAM bits to support large on-chip buffering, lookup tables, and data storage for high-throughput designs.
• I/O Density  1160 I/O pins enabling extensive external interfacing for multi-channel systems and dense connectivity requirements.
• Power and Supply  Optimized core supply range of 820 mV to 880 mV to match the device’s power domain requirements.
• Operating Range  Industrial-grade operation from −40°C to 100°C for deployment in demanding environmental conditions.
• Package & Mounting  Surface-mount 2912-BBGA (2912-FBGA, FC 55×55) package for compact board-level integration.
• Family Innovations  Stratix 10 family features such as the Intel Hyperflex core architecture, 14 nm FinFET process, and heterogeneous 3D SiP transceiver tile technology are part of the device lineage and provide a platform-level performance and integration roadmap.
• Compliance  RoHS compliant to meet regulatory requirements for hazardous substance restrictions.

Typical Applications

• High‑Bandwidth Networking  Used in switches, routers and line cards where high logic capacity and large on-chip memory support packet processing, buffering and custom protocol handling.
• Telecommunications Equipment  Suitable for physical layer processing, forward error correction and multi-channel aggregation leveraging the device’s I/O density and family transceiver capabilities.
• Data Center Acceleration  Applies to compute acceleration, custom offload engines and data-plane functions that need substantial programmable logic and memory resources.
• Industrial Systems  Ideal for industrial control, automation and instrumentation systems that require extended temperature operation and high integration on a single device.

Unique Advantages

• Massive Logic and Memory  2.5 million logic elements combined with over 204 million RAM bits reduces the need for external programmable logic and memory subsystems.
• High Connectivity  1160 I/O pins enable dense interfacing to multiple peripherals, sensors, and high-speed PHYs without extensive external multiplexing.
• Industrial Temperature Rating  Rated from −40°C to 100°C for reliable operation across a wide range of industrial environments.
• Compact, Board-Ready Package  2912-BBGA FCBGA package provides a high-pin-count, surface-mount solution for space-constrained PCB designs.
• Stratix 10 Family Technology  Leverages well-documented family-level innovations such as Hyperflex architecture and 14 nm FinFET process for scalable performance and efficiency.

Why Choose 1SG250HH3F55I3XG?

The 1SG250HH3F55I3XG positions itself for designs that demand very large programmable logic capacity, extensive on-chip memory, and high I/O count in an industrial-grade FPGA. It is well suited to system-level integration where consolidating logic, interfaces, and buffering into a single device reduces board complexity and BOM count.

Choosing this Stratix 10 GX device provides access to the device family’s architectural innovations and a clear upgrade path within the Stratix 10 portfolio for projects that may scale in logic, bandwidth, or system integration requirements.

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