1SG250HN1F43E2LG

The 1SG250HN1F43E2LG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-BBGA (FCBGA) package. It delivers a high-density programmable fabric with 2,500,000 logic elements and large embedded RAM for advanced, bandwidth- and compute-intensive designs.

Built on the Stratix 10 family innovations, this device targets high-performance applications that require substantial logic capacity, extensive I/O, and advanced system-level integration while operating from a low-voltage core supply.

Key Features

• Core architecture (family-level): Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) technology are among the Stratix 10 family innovations driving improved core performance and power efficiency.
• Logic capacity: 2,500,000 logic elements, suitable for very large-scale programmable logic implementations.
• Embedded memory: 204,472,320 total RAM bits to support large buffering, on-chip data storage, and fast local memory access.
• I/O and connectivity: 688 general-purpose I/O pins provided on the device package; family-level transceiver capabilities include high-speed channels and heterogeneous 3D SiP transceiver tiles.
• Package and mounting: 1760-BBGA (FCBGA) surface-mount package; supplier device package specified as 1760-FBGA (42.5 × 42.5 mm) for high-density board integration.
• Power: Core voltage supply range 820 mV to 880 mV for the device core.
• Temperature and grade: Extended grade with an operating temperature range of 0 °C to 100 °C.
• System-level IP (family-level): Stratix 10 family includes hard IP options such as PCI Express Gen3 x16, 10G Ethernet with Forward Error Correction (FEC), and hard memory controllers supporting high-rate DDR4 operation.
• Compliance: RoHS compliant.

Typical Applications

• High-performance networking and data center acceleration: Large logic capacity, abundant RAM, and extensive I/O support packet processing, switch and router functions, and FPGA-based acceleration.
• Telecommunications and backplane systems: Family-level high-speed transceivers and hard communications IP make the device suitable for backplane, line card, and transport applications.
• Signal processing and DSP-intensive workloads: Large on-chip RAM and the Stratix 10 family’s variable-precision DSP resources support high-throughput digital signal processing and algorithm acceleration.
• SoC and embedded processing platforms: Family variants include an embedded hard processor system (HPS) option and system integration features for complex SoC-style designs.

Unique Advantages

• Massive programmable capacity: 2,500,000 logic elements enable very large, consolidated FPGA implementations that reduce the need for multiple devices.
• Substantial on-chip memory: 204,472,320 total RAM bits provide extensive local storage for buffering, data manipulation, and state retention.
• High I/O density: 688 I/O pins in a compact 1760-BBGA package support complex board-level routing and rich external connectivity.
• Compact, industry-standard package: 1760-FBGA (42.5 × 42.5 mm) supplier package supports high-density PCB layouts while maintaining surface-mount assembly compatibility.
• Low-voltage core operation: Core supply range of 820–880 mV can help align power delivery design for modern high-performance FPGA fabrics.
• Designed for performance-focused systems: Leveraging Stratix 10 family features such as Hyperflex architecture, high-speed transceivers, and hard IP enables system designers to address bandwidth- and compute-intensive use cases.

Why Choose 1SG250HN1F43E2LG?

1SG250HN1F43E2LG positions itself as a high-density Stratix 10 GX FPGA option for system designs that require extensive logic, large embedded memory, and broad I/O in a single device. Its package and electrical specifications support integration into demanding board-level designs where space and performance are critical.

Engineers developing advanced networking, telecommunications, DSP, or SoC-class applications can leverage the Stratix 10 family innovations combined with the specific device attributes—large logic capacity, significant on-chip RAM, and a high I/O count—to scale designs and streamline system architecture.

Request a quote or submit an RFQ for part number 1SG250HN1F43E2LG to begin procurement or obtain pricing and availability details.