1SG250HN1F43E2VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2500000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,219 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 312500 | Number of Logic Elements/Cells | 2500000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 204472320 |
Overview of 1SG250HN1F43E2VG – Stratix® 10 GX FPGA, 2,500,000 Logic Elements, 688 I/O, 1760-BBGA
The 1SG250HN1F43E2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) provided in a 1760-BBGA surface-mount package. This device features a high-capacity fabric with 2,500,000 logic elements, substantial embedded memory (204,472,320 total RAM bits), and 688 general-purpose I/O, delivering the resources required for demanding bandwidth- and compute-oriented designs.
Built on the Stratix 10 GX family architecture, the device targets high-performance applications that need large logic capacity, dense on-chip memory, and high-speed I/O while operating within a 0 °C to 100 °C range and a core supply window of 770 mV to 970 mV.
Key Features
- Logic Capacity 2,500,000 logic elements provide extensive programmable fabric for complex custom logic, large state machines, and advanced signal processing.
- On-Chip Memory 204,472,320 total RAM bits of embedded memory to store large datasets, buffering, and frame/frame-rate processing directly on-chip.
- I/O Density 688 I/O pins support broad peripheral interfacing, wide parallel buses, and multi-lane connectivity for high-bandwidth systems.
- Package and Mounting 1760-BBGA (FCBGA) package, supplier package 1760-FBGA with a 42.5 × 42.5 mm footprint, designed for surface-mount assembly.
- Power Supply Range Core voltage support from 770 mV to 970 mV for integration with modern power-rail architectures.
- Operating Range and Grade Grade: Extended; specified operating temperature range of 0 °C to 100 °C for deployments in controlled thermal environments.
- Standards and Compliance RoHS compliant.
- Stratix 10 GX Family Innovations Family-level features include the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology, delivering improved core performance and power efficiency relative to previous generations.
Typical Applications
- High‑Performance Networking Large logic and dense I/O support packet processing, line-rate switching, and multi‑lane transceiver interfaces for networking equipment.
- Data Center Acceleration On-chip memory and large logic resources enable hardware acceleration for data-path processing, compression, and custom compute tasks.
- High‑Bandwidth IO Systems Extensive I/O count and package options facilitate multi-channel data acquisition, test and measurement instrumentation, and backplane connectivity.
- Complex Signal Processing Massive logic and embedded RAM make the device suitable for DSP pipelines, large lookup tables, and real‑time data handling.
Unique Advantages
- Massive Logic and Memory Resources: 2,500,000 logic elements and over 204 million bits of RAM let designers implement large-scale custom architectures without partitioning across multiple devices.
- High I/O Count: 688 I/O pins reduce the need for external multiplexing, simplifying board routing and improving system throughput.
- Advanced Package Density: 1760-BBGA (42.5 × 42.5 mm) package provides a compact, high-pin-count solution for space-constrained, high-performance boards.
- Configurable Power Envelope: Core supply range of 770 mV–970 mV supports modern power delivery schemes and helps optimize power/performance trade-offs.
- Extended Temperature Grade: 0 °C to 100 °C operating range supports deployment in applications with moderate thermal requirements.
- RoHS Compliance: Meets RoHS environmental regulations for lead‑free assembly.
Why Choose 1SG250HN1F43E2VG?
The 1SG250HN1F43E2VG provides a high-capacity, high-density Stratix 10 GX FPGA implementation that pairs extensive logic and memory resources with a large I/O complement and an advanced BGA package. It is positioned for designs that require substantial on-chip compute and buffering, broad parallel connectivity, and the family-level performance improvements of the Stratix 10 GX architecture.
This device suits system designers and engineers building networking, data center acceleration, high-bandwidth acquisition, or complex signal processing systems that need scalable logic capacity, dense I/O, and controlled operating temperature and power characteristics backed by Intel’s Stratix 10 family features.
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