1SG250HN1F43E2VG

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2500000 1760-BBGA, FCBGA

Quantity 1,219 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs312500Number of Logic Elements/Cells2500000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits204472320

Overview of 1SG250HN1F43E2VG – Stratix® 10 GX FPGA, 2,500,000 Logic Elements, 688 I/O, 1760-BBGA

The 1SG250HN1F43E2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) provided in a 1760-BBGA surface-mount package. This device features a high-capacity fabric with 2,500,000 logic elements, substantial embedded memory (204,472,320 total RAM bits), and 688 general-purpose I/O, delivering the resources required for demanding bandwidth- and compute-oriented designs.

Built on the Stratix 10 GX family architecture, the device targets high-performance applications that need large logic capacity, dense on-chip memory, and high-speed I/O while operating within a 0 °C to 100 °C range and a core supply window of 770 mV to 970 mV.

Key Features

  • Logic Capacity  2,500,000 logic elements provide extensive programmable fabric for complex custom logic, large state machines, and advanced signal processing.
  • On-Chip Memory  204,472,320 total RAM bits of embedded memory to store large datasets, buffering, and frame/frame-rate processing directly on-chip.
  • I/O Density  688 I/O pins support broad peripheral interfacing, wide parallel buses, and multi-lane connectivity for high-bandwidth systems.
  • Package and Mounting  1760-BBGA (FCBGA) package, supplier package 1760-FBGA with a 42.5 × 42.5 mm footprint, designed for surface-mount assembly.
  • Power Supply Range  Core voltage support from 770 mV to 970 mV for integration with modern power-rail architectures.
  • Operating Range and Grade  Grade: Extended; specified operating temperature range of 0 °C to 100 °C for deployments in controlled thermal environments.
  • Standards and Compliance  RoHS compliant.
  • Stratix 10 GX Family Innovations  Family-level features include the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology, delivering improved core performance and power efficiency relative to previous generations.

Typical Applications

  • High‑Performance Networking  Large logic and dense I/O support packet processing, line-rate switching, and multi‑lane transceiver interfaces for networking equipment.
  • Data Center Acceleration  On-chip memory and large logic resources enable hardware acceleration for data-path processing, compression, and custom compute tasks.
  • High‑Bandwidth IO Systems  Extensive I/O count and package options facilitate multi-channel data acquisition, test and measurement instrumentation, and backplane connectivity.
  • Complex Signal Processing  Massive logic and embedded RAM make the device suitable for DSP pipelines, large lookup tables, and real‑time data handling.

Unique Advantages

  • Massive Logic and Memory Resources:  2,500,000 logic elements and over 204 million bits of RAM let designers implement large-scale custom architectures without partitioning across multiple devices.
  • High I/O Count:  688 I/O pins reduce the need for external multiplexing, simplifying board routing and improving system throughput.
  • Advanced Package Density:  1760-BBGA (42.5 × 42.5 mm) package provides a compact, high-pin-count solution for space-constrained, high-performance boards.
  • Configurable Power Envelope:  Core supply range of 770 mV–970 mV supports modern power delivery schemes and helps optimize power/performance trade-offs.
  • Extended Temperature Grade:  0 °C to 100 °C operating range supports deployment in applications with moderate thermal requirements.
  • RoHS Compliance:  Meets RoHS environmental regulations for lead‑free assembly.

Why Choose 1SG250HN1F43E2VG?

The 1SG250HN1F43E2VG provides a high-capacity, high-density Stratix 10 GX FPGA implementation that pairs extensive logic and memory resources with a large I/O complement and an advanced BGA package. It is positioned for designs that require substantial on-chip compute and buffering, broad parallel connectivity, and the family-level performance improvements of the Stratix 10 GX architecture.

This device suits system designers and engineers building networking, data center acceleration, high-bandwidth acquisition, or complex signal processing systems that need scalable logic capacity, dense I/O, and controlled operating temperature and power characteristics backed by Intel’s Stratix 10 family features.

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