1SG250HH3F55E2VG

The 1SG250HH3F55E2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 2912‑BBGA FCBGA package. It combines a very large logic capacity with substantial embedded memory and high I/O density for demanding, high‑performance applications.

As part of the Stratix 10 family, the device leverages the Intel Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) technology described for the family, targeting applications that require high core performance, large on‑chip RAM, and extensive connectivity.

Key Features

• Logic Capacity — 2,500,000 logic elements for complex, parallelizable designs and large custom hardware functions.
• Embedded Memory — 204,472,320 total RAM bits to support large on‑chip buffering, packet processing, and data buffering needs.
• I/O Density — 1,160 I/O pins to accommodate high‑pincount interfaces and multiple high‑speed links.
• Core Architecture — Intel Hyperflex core architecture (family feature) delivering up to 2× core performance versus previous generation high‑performance FPGAs.
• High‑Speed Transceivers (Family) — Stratix 10 family features include heterogeneous 3D SiP transceiver tiles and transceiver data rates up to 28.3 Gbps for high‑bandwidth chip‑to‑chip and backplane links.
• Hard IP (Family) — Family-level hard IP options include PCI Express Gen3 and 10G Ethernet, supporting common high‑speed system interfaces.
• Power — Specified core voltage supply range of 770 mV to 970 mV to match modern low‑voltage FPGA power architectures.
• Package & Mounting — 2912‑BBGA, FCBGA (55 × 55 mm supplier package) in a surface‑mount form factor for board‑level integration.
• Operating Range — Extended grade with an operating temperature range of 0 °C to 100 °C and RoHS compliance.

Typical Applications

• High‑performance networking — High I/O count and family transceiver capabilities enable switching, routing and backplane applications requiring large routing fabrics and high data throughput.
• Data center acceleration — Large logic and on‑chip RAM support custom acceleration functions such as packet processing, encryption, and data path offload.
• High‑speed communications — Use in systems that need multi‑lane high‑speed serial links and PCI Express connectivity (family‑level hard IP available) for interfacing with host and module fabrics.
• Signal processing and DSP — Substantial logic and memory resources suit demanding DSP pipelines and variable‑precision compute tasks described for the Stratix 10 family.

Unique Advantages

• Very high logic scale: 2.5 million logic elements enable large, integrated hardware functions and reduce the need for multiple devices.
• Large on‑chip memory: Over 204 million RAM bits allow significant buffering and in‑FPGA data storage for low‑latency processing.
• High interface count: 1,160 I/O pins provide flexibility for combining many external interfaces without additional bridging logic.
• Modern process and architecture: Intel 14 nm tri‑gate technology and the Hyperflex core architecture (family) deliver higher core performance for compute‑intensive designs.
• System integration readiness: Family‑level hard IP for PCIe and Ethernet and high‑speed transceivers simplify implementation of common system interfaces.
• Board‑friendly package: 2912‑BBGA surface‑mount package (55 × 55 mm supplier format) supports dense PCB integration in advanced systems.

Why Choose 1SG250HH3F55E2VG?

This Stratix 10 GX device balances very large programmable logic capacity, extensive on‑chip memory, and high I/O density within a surface‑mount 2912‑BBGA package. It is positioned for designers building high‑bandwidth communications, data center acceleration, and signal processing systems that require significant on‑chip resources and robust connectivity options.

Selecting the 1SG250HH3F55E2VG provides scalable capacity and family‑level capabilities (Hyperflex architecture, high‑speed transceivers, and hard interface IP) that help future‑proof complex designs while leveraging the Stratix 10 ecosystem and documentation for development and deployment.

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