1SG250HH2F55I2VG

IC FPGA 1160 I/O 2912BGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 1160 2500000 2912-BBGA, FCBGA

Quantity 627 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2912-FBGA, FC (55x55)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2912-BBGA, FCBGANumber of I/O1160Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs312500Number of Logic Elements/Cells2500000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits204472320

Overview of 1SG250HH2F55I2VG – Stratix® 10 GX FPGA IC, 2,500,000 Logic Elements, 2912-BBGA (FCBGA)

The 1SG250HH2F55I2VG is an Intel Stratix® 10 GX field-programmable gate array (FPGA) offered in a 2912-BBGA (FCBGA) package. It integrates high fabric capacity and extensive I/O in an industrial-grade surface-mount package for demanding, high-performance applications.

Built on the Stratix 10 family architecture, this device targets designs that require large logic resources, substantial on-chip RAM, and broad I/O connectivity while operating across an industrial temperature range.

Key Features

  • Core Architecture – Stratix 10 family innovations including the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology (family-level features documented in the Stratix 10 GX/SX overview).
  • Logic Capacity – 2,500,000 logic elements, providing large-scale programmable fabric for complex designs.
  • Embedded Memory – 204,472,320 total RAM bits for on-chip data buffering, state storage, and memory-intensive algorithms.
  • I/O Density – 1,160 I/Os to support wide parallel interfaces, multi-channel front-ends, and dense board-level connectivity.
  • Power Supply – Core voltage operating range from 770 mV to 970 mV to match system power-rail designs.
  • Package & Mounting – 2912-BBGA (FCBGA) supplier device package (2912-FBGA, FC 55×55) in a surface-mount form factor for compact, high-density board designs.
  • Operating Range & Grade – Industrial grade with an operating temperature range of −40 °C to 100 °C for reliable deployment in harsh environments.
  • Compliance – RoHS compliant.
  • Stratix 10 Family Capabilities (series-level) – The family overview documents high-performance features such as heterogeneous 3D SiP transceiver tiles, high-speed transceiver performance, hard IP for PCI Express and memory interfaces, and advanced DSP and PLL capabilities (refer to Stratix 10 family documentation for details).

Typical Applications

  • High-Speed Networking – Use the device’s high I/O count and family-level transceiver capabilities for switching, routing, and network interface applications that require substantial parallel and serial connectivity.
  • Data Center Acceleration – Large logic capacity and extensive embedded RAM support custom acceleration functions, packet processing, and inline data manipulation within data center systems.
  • Telecommunications & Broadcast – Industrial operating range and high I/O density make this FPGA suitable for linecards, aggregation switches, and video processing infrastructure.
  • Test & Measurement – High logic density and on-chip memory support real-time signal processing, capture buffers, and complex measurement algorithms in industrial test equipment.

Unique Advantages

  • Massive Programmable Capacity: 2,500,000 logic elements deliver the headroom needed for large-scale designs without partitioning across multiple devices.
  • Substantial On-Chip RAM: Over 204 million bits of embedded RAM reduce external memory dependency for many buffering and stateful processing tasks.
  • High I/O Count: 1,160 I/Os enable wide parallel interfaces and numerous peripheral connections directly to the FPGA.
  • Industrial Reliability: −40 °C to 100 °C operating range and industrial grade classification support deployment in demanding environments.
  • Compact, High-Density Package: 2912-BBGA FCBGA (55×55) package supports dense PCB integration while preserving extensive I/O and silicon resources.
  • Controlled Core Voltage: Narrow supply window (770 mV–970 mV) facilitates predictable power design and integration with modern power management solutions.

Why Choose 1SG250HH2F55I2VG?

The 1SG250HH2F55I2VG positions itself as a high-capacity Stratix 10 GX FPGA option for teams needing large programmable fabric, extensive embedded RAM, and a high count of I/Os in an industrial-grade package. Its specifications align with complex networking, data center, and instrumentation designs that demand both scale and reliability.

Choosing this device provides a scalable hardware building block for advanced processing tasks while meeting industrial temperature and RoHS compliance requirements, enabling long-term deployment in production systems that require high logic density and robust board-level integration.

Request a quote or submit an inquiry for pricing and availability for the 1SG250HH2F55I2VG to begin evaluating this Stratix 10 GX FPGA for your next high-performance design.

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