1SG250HH2F55I2VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 1160 2500000 2912-BBGA, FCBGA |
|---|---|
| Quantity | 627 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2912-FBGA, FC (55x55) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2912-BBGA, FCBGA | Number of I/O | 1160 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 312500 | Number of Logic Elements/Cells | 2500000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 204472320 |
Overview of 1SG250HH2F55I2VG – Stratix® 10 GX FPGA IC, 2,500,000 Logic Elements, 2912-BBGA (FCBGA)
The 1SG250HH2F55I2VG is an Intel Stratix® 10 GX field-programmable gate array (FPGA) offered in a 2912-BBGA (FCBGA) package. It integrates high fabric capacity and extensive I/O in an industrial-grade surface-mount package for demanding, high-performance applications.
Built on the Stratix 10 family architecture, this device targets designs that require large logic resources, substantial on-chip RAM, and broad I/O connectivity while operating across an industrial temperature range.
Key Features
- Core Architecture – Stratix 10 family innovations including the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology (family-level features documented in the Stratix 10 GX/SX overview).
- Logic Capacity – 2,500,000 logic elements, providing large-scale programmable fabric for complex designs.
- Embedded Memory – 204,472,320 total RAM bits for on-chip data buffering, state storage, and memory-intensive algorithms.
- I/O Density – 1,160 I/Os to support wide parallel interfaces, multi-channel front-ends, and dense board-level connectivity.
- Power Supply – Core voltage operating range from 770 mV to 970 mV to match system power-rail designs.
- Package & Mounting – 2912-BBGA (FCBGA) supplier device package (2912-FBGA, FC 55×55) in a surface-mount form factor for compact, high-density board designs.
- Operating Range & Grade – Industrial grade with an operating temperature range of −40 °C to 100 °C for reliable deployment in harsh environments.
- Compliance – RoHS compliant.
- Stratix 10 Family Capabilities (series-level) – The family overview documents high-performance features such as heterogeneous 3D SiP transceiver tiles, high-speed transceiver performance, hard IP for PCI Express and memory interfaces, and advanced DSP and PLL capabilities (refer to Stratix 10 family documentation for details).
Typical Applications
- High-Speed Networking – Use the device’s high I/O count and family-level transceiver capabilities for switching, routing, and network interface applications that require substantial parallel and serial connectivity.
- Data Center Acceleration – Large logic capacity and extensive embedded RAM support custom acceleration functions, packet processing, and inline data manipulation within data center systems.
- Telecommunications & Broadcast – Industrial operating range and high I/O density make this FPGA suitable for linecards, aggregation switches, and video processing infrastructure.
- Test & Measurement – High logic density and on-chip memory support real-time signal processing, capture buffers, and complex measurement algorithms in industrial test equipment.
Unique Advantages
- Massive Programmable Capacity: 2,500,000 logic elements deliver the headroom needed for large-scale designs without partitioning across multiple devices.
- Substantial On-Chip RAM: Over 204 million bits of embedded RAM reduce external memory dependency for many buffering and stateful processing tasks.
- High I/O Count: 1,160 I/Os enable wide parallel interfaces and numerous peripheral connections directly to the FPGA.
- Industrial Reliability: −40 °C to 100 °C operating range and industrial grade classification support deployment in demanding environments.
- Compact, High-Density Package: 2912-BBGA FCBGA (55×55) package supports dense PCB integration while preserving extensive I/O and silicon resources.
- Controlled Core Voltage: Narrow supply window (770 mV–970 mV) facilitates predictable power design and integration with modern power management solutions.
Why Choose 1SG250HH2F55I2VG?
The 1SG250HH2F55I2VG positions itself as a high-capacity Stratix 10 GX FPGA option for teams needing large programmable fabric, extensive embedded RAM, and a high count of I/Os in an industrial-grade package. Its specifications align with complex networking, data center, and instrumentation designs that demand both scale and reliability.
Choosing this device provides a scalable hardware building block for advanced processing tasks while meeting industrial temperature and RoHS compliance requirements, enabling long-term deployment in production systems that require high logic density and robust board-level integration.
Request a quote or submit an inquiry for pricing and availability for the 1SG250HH2F55I2VG to begin evaluating this Stratix 10 GX FPGA for your next high-performance design.

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