1SG250HH2F55E2VG

The 1SG250HH2F55E2VG is an Intel Stratix® 10 GX field-programmable gate array (FPGA) in a 2912-BBGA surface-mount package. It delivers high logic capacity and large on-chip memory, suited for advanced, bandwidth- and processing-intensive designs.

Built on the Stratix 10 GX family architecture, this device targets applications that require large programmable logic resources, extensive I/O, and integrated system capabilities documented for the Stratix 10 GX/SX device family.

Key Features

• High Logic Density — 2,500,000 logic elements to implement complex custom logic, control and data-path functions.
• On‑Chip Memory — 204,472,320 total RAM bits for large buffers, FIFOs and state storage directly in the FPGA fabric.
• Extensive I/O — 1,160 I/Os to support wide parallel interfaces, memory buses and multiple high-speed links.
• Advanced Fabric Architecture — Stratix 10 Hyperflex core architecture and Intel 14 nm tri-gate technology are documented features of the Stratix 10 GX/SX family for high core performance and power efficiency.
• Transceiver and High‑Speed IO Capabilities (Family-Level) — The Stratix 10 family includes heterogeneous transceiver tiles and transceiver PMA/PCS features, with documented transceiver data rates up to 28.3 Gbps for high-bandwidth link applications.
• Hard IP (Family-Level) — Family documentation notes availability of hard PCIe Gen3 x16 IP and hard Ethernet FEC capabilities in Stratix 10 devices.
• Package and Mounting — 2912-BBGA (FCBGA) supplier device package 2912-FBGA, FC (55×55); surface mount for board-level assembly.
• Power and Thermal — Supported supply range from 770 mV to 970 mV; operating temperature 0 °C to 100 °C; device grade: Extended.
• RoHS Compliant — Meets RoHS environmental compliance requirements.

Typical Applications

• Network and Telecom Infrastructure — High logic density, extensive I/O and family-level high-speed transceivers support packet processing, line cards and backplane interfaces.
• Data Center Accelerators — Large on-chip memory and programmable logic are suitable for buffering, custom offload functions and data-path acceleration.
• High‑Performance Computing and Signal Processing — The combination of millions of logic elements and substantial RAM bits enables implementation of complex DSP and compute pipelines.
• Storage and Memory Controllers — High I/O count and documented family-level hard memory controllers support demanding storage and memory interface implementations.

Unique Advantages

• Massive Programmable Capacity: 2.5 million logic elements allow implementation of large, integrated systems on a single device, reducing board-level component count.
• Large On-Die Memory: Over 204 million bits of RAM enable deep buffering and extensive state retention without external memory for many designs.
• Broad I/O Count: 1,160 I/Os simplify connectivity to multiple high-bandwidth peripherals, memory devices and I/O standards.
• Family-Level High-Speed SerDes: Stratix 10 GX family transceiver capabilities provide documented support for multi-gigabit links suitable for demanding data throughput.
• Extended Operating Grade: Extended temperature grade (0 °C to 100 °C) supports deployments in a wide range of system environments.
• Compact, Assembly-Ready Package: 2912-BBGA FCBGA package in a 55×55 supplier footprint enables high-density board layouts with surface-mount assembly.

Why Choose 1SG250HH2F55E2VG?

The 1SG250HH2F55E2VG delivers the programmable capacity, memory and I/O resources required for complex, high-throughput embedded systems. As a Stratix 10 GX device from Intel, it aligns with the family characteristics documented for high core performance, advanced fabric architecture and high-speed connectivity.

This part suits engineers and system designers building bandwidth‑intensive network, compute or storage solutions who need a large, single-chip programmable platform with extensive on‑chip RAM, many I/Os and a robust package for surface-mount assembly.

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