1SG250HH1F55I2LG

The 1SG250HH1F55I2LG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 2912-ball BGA (FCBGA) package. It provides very high logic density and extensive on-chip memory alongside a large I/O complement, engineered for demanding, bandwidth- and compute‑intensive applications.

Built on the Stratix 10 family architecture, this device combines the family’s Hyperflex core innovations and high-performance FPGA features with industrial-grade operating ranges and a low-voltage core supply to support robust, high-throughput system designs.

Key Features

• Core and Logic  Intel Stratix 10 family Hyperflex core architecture; the device provides 2,500,000 logic elements for large-scale programmable logic integration.
• On-chip Memory  Total embedded memory of 204,472,320 bits to support large buffering, lookup tables, and on‑chip data storage.
• I/O and Connectivity  1,160 user I/O pins to support broad peripheral and interface integration. (Family-level transceiver and high-speed interface features are documented in the Stratix 10 GX device overview.)
• DSP and Processing (Family-Level)  Stratix 10 family includes variable-precision DSP capability—useful for signal processing and compute‑intensive tasks (refer to family datasheet for block details).
• Package and Mounting  2912-BBGA FCBGA package (supplier package: 2912-FBGA FC, 55 × 55 mm), surface-mount construction for PCB assembly.
• Power and Thermal  Core voltage supply range 820 mV to 880 mV; operating temperature range −40 °C to 100 °C, supporting industrial environments.
• Grade and Compliance  Specified as Industrial grade and RoHS compliant.

Typical Applications

• High‑Performance Networking & Telecom  Large logic capacity, extensive on‑chip RAM, and high I/O count make this device suitable for packet processing, switching fabrics, and line-rate accelerators.
• Data Center Acceleration  Massive logic resources and embedded memory support hardware acceleration for compute and storage tasks that require significant parallelism and on‑chip buffering.
• High‑Speed Test & Measurement  The combination of dense logic and a high I/O count enables complex capture, processing, and control logic in instrumentation and testing systems.
• Advanced Signal Processing  On‑chip RAM and the Stratix 10 family DSP features support implementation of large-scale digital signal processing chains and algorithmic compute blocks.

Unique Advantages

• Very high logic density: 2,500,000 logic elements allow integration of large, complex designs on a single device, reducing board-level partitioning.
• Large on‑chip memory: 204,472,320 bits of RAM provide significant local storage for buffering, lookup tables, and state retention without external memory.
• Extensive I/O availability: 1,160 user I/Os simplify connectivity to peripherals, high-speed PHYs, and multi-interface systems.
• Industrial temperature range: Rated for −40 °C to 100 °C operation to meet industrial deployment needs.
• Compact, production-ready package: 2912-ball FCBGA (55 × 55 mm) surface-mount package supports high-density PCB implementations with established assembly flows.
• Family-level performance innovations: Leverages Stratix 10 family features such as the Hyperflex core architecture to address high-throughput and compute-intensive designs.

Why Choose 1SG250HH1F55I2LG?

The 1SG250HH1F55I2LG combines multi-million‑element logic capacity, hundreds of megabits of on‑chip RAM, and a large I/O complement in a production-ready FCBGA package, positioning it for demanding applications where integration, bandwidth, and computational density matter. Its industrial operating range and controlled low-voltage core supply make it suitable for robust, long‑lifecycle systems.

This device is appropriate for engineering teams building high-performance networking, data center acceleration, advanced instrumentation, and signal-processing systems that require scalable logic resources, extensive memory, and broad I/O connectivity supported by the Stratix 10 device family.

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