1SG250HH1F55I1VG

The 1SG250HH1F55I1VG is an Intel Stratix® 10 GX high-performance FPGA in a 2912-BBGA (55×55) package, rated for industrial operation. It combines a large logic fabric with substantial on-chip RAM and extensive I/O to address demanding bandwidth and compute-oriented designs.

As part of the Stratix 10 GX family, the device leverages the family’s core innovations to deliver increased core performance and power efficiency for applications that require high logic capacity, dense I/O, and advanced memory and transceiver capabilities.

Key Features

• Core Architecture  Built on the Intel Stratix 10 GX family architecture, which the series documents describe as featuring the Intel Hyperflex core architecture for improved core performance.
• Logic Capacity  2,500,000 logic elements (LEs), providing a very large programmable fabric for complex logic and custom acceleration functions.
• On‑chip Memory  204,472,320 total RAM bits of embedded memory to support large buffering, caches, and state storage within the FPGA fabric.
• I/O Density  1,160 user I/O pins to support wide parallel interfaces and numerous peripheral connections on a single device.
• High‑speed Transceiver & Interface Capability  Stratix 10 GX family documentation highlights heterogeneous 3D SiP transceiver tiles and high-rate transceiver capabilities, suitable for high-bandwidth serial links and board/backplane interfaces.
• Package & Mounting  2912‑BBGA FCBGA package (supplier package 2912‑FBGA, 55×55) with surface-mount mounting for high-density board integration.
• Power Supply  Core voltage supply range of 770 mV to 970 mV to match system power-rail requirements and design constraints.
• Industrial Temperature Rating  Operating temperature range from −40 °C to 100 °C and specified as Industrial grade for deployment in demanding environments.
• Standards & Compliance  RoHS compliant.

Typical Applications

• High‑Bandwidth Networking & Datacom  Used to implement packet processing, switching, and line-rate functions that benefit from large logic capacity and family-level transceiver capabilities.
• Compute Acceleration & DSP  Deploys large numbers of logic elements and on-chip RAM for custom accelerators, signal processing pipelines, and compute offload.
• Backplane and Board‑Level Communications  Supports dense I/O and high-speed serial interfaces for board-to-board and backplane communications in enterprise and telecom equipment.
• SoC and Embedded Systems (Family Variants)  Fits designs that combine programmable fabric with SoC-style integration available elsewhere in the Stratix 10 family for embedded processing and system consolidation.

Unique Advantages

• Massive Logic Capacity: 2,500,000 logic elements enable large, monolithic designs that reduce the need for multi‑device partitioning.
• Large On‑Chip Memory: Over 204 million bits of embedded RAM reduce external memory dependence for buffering and stateful processing.
• Extensive I/O Resources: 1,160 I/O pins support complex, high‑pin‑count interfaces and multiple peripheral connections on a single package.
• Industrial Temperature Support: Rated −40 °C to 100 °C to meet thermal requirements for industrial applications.
• High‑Density Package: 2912‑BBGA (55×55) package provides a compact, manufacturable footprint for high‑pin‑count system designs.
• Family‑Level Performance Innovations: Benefits from Stratix 10 GX family innovations such as the Hyperflex core architecture and advanced transceiver technology to address bandwidth and performance needs.

Why Choose 1SG250HH1F55I1VG?

The 1SG250HH1F55I1VG is positioned for designs that require very high logic capacity, large on‑chip RAM, and extensive I/O in an industrial temperature‑rated FPGA. Its combination of 2.5 million logic elements, over 204 million RAM bits, and 1,160 I/O make it suitable for consolidating complex functions into a single device.

Choosing this Stratix 10 GX FPGA lets designers target scalable, high‑performance architectures—particularly where dense logic, significant embedded memory, and family‑level high‑speed interface capabilities are required. The industrial rating and RoHS compliance support deployment in demanding environments while meeting regulatory requirements.

Request a quote or submit an inquiry to receive pricing and availability for 1SG250HH1F55I1VG and to discuss how this device fits your next high‑performance FPGA design.